Global Patent Index - EP 3084043 B1

EP 3084043 B1 20180530 - METHOD FOR ELECTROLYTIC SURFACE MODIFICATION OF FLAT METAL WORKPIECES IN COPPER-SULFATE TREATMENT LIQUID CONTAINING SULFATE-METALLATES

Title (en)

METHOD FOR ELECTROLYTIC SURFACE MODIFICATION OF FLAT METAL WORKPIECES IN COPPER-SULFATE TREATMENT LIQUID CONTAINING SULFATE-METALLATES

Title (de)

VERFAHREN ZUR ELEKTROLYTISCHEN OBERFLÄCHENMODIFIZIERUNG VON FLÄCHIGEN METALLWERKSTÜCKEN IN SULFATOMETALLATHALTIGEN KUPFERSULFAT-BEHANDLUNGSFLÜSSIGKEITEN

Title (fr)

PROCÉDÉ DE MODIFICATION DE SURFACE ÉLECTROLYTIQUE DE PIÈCES MÉTALLIQUES PLATES DANS DES LIQUIDES DE TRAÎTEMENT AU SULFATE DE CUIVRE CONTENANT DU SULFATOMÉTALLATE

Publication

EP 3084043 B1 20180530 (DE)

Application

EP 14823977 A 20141218

Priority

  • DE 102013022030 A 20131219
  • EP 2014078569 W 20141218

Abstract (en)

[origin: WO2015091863A1] The invention relates to a method for the electrolytic surface modification of a flat workpiece by the deposition of copper aggregates. The invention also relates to flat metal workpieces that can be produced using this method and to the use of said metal workpieces as substrates for the formation of secure adhesive bonds comprising a plurality of materials.

IPC 8 full level

C25D 3/38 (2006.01); C25D 3/58 (2006.01); C25D 7/06 (2006.01); C25D 5/34 (2006.01)

CPC (source: EP KR US)

C25D 3/38 (2013.01 - EP KR US); C25D 3/58 (2013.01 - EP KR US); C25D 5/34 (2013.01 - KR); C25D 7/0628 (2013.01 - EP KR US); C25D 7/0664 (2013.01 - EP KR US); C25D 7/0692 (2013.01 - EP KR US); C25F 7/00 (2013.01 - EP US); C25D 5/34 (2013.01 - EP US)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2015091863 A1 20150625; DE 102013022030 A1 20150625; DE 102013022030 B4 20171005; DK 3084043 T3 20180625; EP 3084043 A1 20161026; EP 3084043 B1 20180530; JP 2017501308 A 20170112; KR 20160100319 A 20160823; US 2016319448 A1 20161103

DOCDB simple family (application)

EP 2014078569 W 20141218; DE 102013022030 A 20131219; DK 14823977 T 20141218; EP 14823977 A 20141218; JP 2016559685 A 20141218; KR 20167017804 A 20141218; US 201415105824 A 20141218