EP 3087592 A2 20161102 - METHOD FOR PRODUCING A CHIP MODULE
Title (en)
METHOD FOR PRODUCING A CHIP MODULE
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES CHIPMODULS
Title (fr)
PROCÉDÉ DE FABRICATION D'UN MODULE DE PUCE
Publication
Application
Priority
- DE 102013114907 A 20131227
- EP 2014075518 W 20141125
Abstract (en)
[origin: WO2015096946A2] The invention concerns a method for producing a chip module (90) having a carrier substrate and at least one chip arranged on the carrier substrate, as well as a contact conductor arrangement (45) for connecting chip pads to contacts (69, 70, 71) arranged on a contact face (56) of the chip module, in which method the front face of the chip which is provided with the chip pads is secured to the carrier substrate and then the contact conductor arrangement is formed by structuring of a contact material layer of the carrier substrate.
IPC 8 full level
H01L 21/48 (2006.01); H01L 23/538 (2006.01)
CPC (source: CN EP US)
H01L 21/4832 (2013.01 - EP US); H01L 23/49562 (2013.01 - EP US); H01L 23/49816 (2013.01 - EP US); H01L 23/5384 (2013.01 - CN EP US); H01L 23/5389 (2013.01 - CN EP US); H01L 24/11 (2013.01 - US); H01L 24/24 (2013.01 - CN EP US); H01L 24/25 (2013.01 - CN EP US); H01L 24/27 (2013.01 - US); H01L 24/29 (2013.01 - US); H01L 24/32 (2013.01 - US); H01L 24/82 (2013.01 - CN EP US); H01L 24/96 (2013.01 - CN EP US); H01L 21/4832 (2013.01 - CN); H01L 23/49562 (2013.01 - CN); H01L 23/49816 (2013.01 - CN); H01L 2224/04105 (2013.01 - EP US); H01L 2224/06181 (2013.01 - EP US); H01L 2224/12105 (2013.01 - CN EP US); H01L 2224/13022 (2013.01 - CN EP US); H01L 2224/16245 (2013.01 - CN EP US); H01L 2224/24137 (2013.01 - CN EP US); H01L 2224/2518 (2013.01 - CN EP US); H01L 2224/32245 (2013.01 - CN EP US); H01L 2224/73204 (2013.01 - CN EP US); H01L 2224/73253 (2013.01 - CN EP US); H01L 2224/73259 (2013.01 - CN EP US); H01L 2224/73267 (2013.01 - CN EP US); H01L 2224/81224 (2013.01 - CN EP US); H01L 2224/81903 (2013.01 - CN EP US); H01L 2224/82005 (2013.01 - EP US); H01L 2224/82039 (2013.01 - EP US); H01L 2224/83192 (2013.01 - CN EP US); H01L 2224/92144 (2013.01 - CN EP US); H01L 2224/92224 (2013.01 - CN EP US)
Citation (search report)
See references of WO 2015096946A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2015096946 A2 20150702; WO 2015096946 A3 20151119; CN 105849901 A 20160810; CN 105849901 B 20190301; DE 102013114907 A1 20150702; EP 3087592 A2 20161102; EP 3236489 A2 20171025; EP 3236489 A3 20180110; US 10354971 B2 20190716; US 2017133340 A1 20170511
DOCDB simple family (application)
EP 2014075518 W 20141125; CN 201480071312 A 20141125; DE 102013114907 A 20131227; EP 14815258 A 20141125; EP 17151929 A 20141125; US 201415106605 A 20141125