EP 3093267 B1 20190807 - ELECTRONIC HIGH FREQUENCY COMPONENT
Title (en)
ELECTRONIC HIGH FREQUENCY COMPONENT
Title (de)
ELEKTRONISCHES HOCHFREQUENZ BAUELEMENT
Title (fr)
COMPOSANT ÉLECTRONIQUE HAUTE FRÉQUENCE
Publication
Application
Priority
EP 15167271 A 20150512
Abstract (en)
[origin: US2016336134A1] The present disclosure relates to an electronic high-frequency component for accommodating micro-devices, having at least two housing parts which are joined together by a metal frame and which enclose a cavity, and at least one input signal line configured to introduce electrical high-frequency signals from outside of the component into the cavity. The input signal line is connected to a signal line via. Furthermore, the high-frequency component also has at least one short-circuit via which electrically connects the metal frame to at least one of the housing parts of the component.
IPC 8 full level
B81B 7/00 (2006.01)
CPC (source: EP US)
B81B 7/007 (2013.01 - EP US); H01H 59/0009 (2013.01 - US)
Citation (examination)
US 2003030516 A1 20030213 - TSUKIYAMA YOSHIO [JP], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3093267 A1 20161116; EP 3093267 B1 20190807; US 10573478 B2 20200225; US 2016336134 A1 20161117
DOCDB simple family (application)
EP 15167271 A 20150512; US 201615151798 A 20160511