Global Patent Index - EP 3112502 A1

EP 3112502 A1 20170104 - METHOD FOR PLATING METALLIC WIRE OR TAPE AND PRODUCT OBTAINED WITH SAID METHOD

Title (en)

METHOD FOR PLATING METALLIC WIRE OR TAPE AND PRODUCT OBTAINED WITH SAID METHOD

Title (de)

VERFAHREN ZUM PLATTIEREN VON METALLISCHEN DRÄHTEN ODER BÄNDERN UND PRODUKT HERGESTELLT MITTELS DIESEM VERFAHREN

Title (fr)

MÉTHODE POUR LE PLACAGE DE FILS OU DE BANDES MÉTALLIQUES ET PRODUIT OBTENU PAR LADITE MÉTHODE

Publication

EP 3112502 A1 20170104 (EN)

Application

EP 16176105 A 20160624

Priority

IT UB20151869 A 20150630

Abstract (en)

The present invention refers to a method for plating a metallic product (10) having a prevailing dimension, like wire or tape, comprising a cycle of treatments of electrolytic type in continuous cycle so as to progressively obtain a metallic product (30) with multilayer plating with low release of nickel; the method comprising the following phases: - Preparatory phase (A, B, C, D); - Phase of electrolytic nickel-plating (E); The plating method also comprises a phase of chromium electroplating (G) following the electrolytic nickel-plating phase (E). The metallic product (10) goes through all the phases in a continuous manner and at a substantially constant speed. The invention also refers to a metallic product obtained through said plating method.

IPC 8 full level

C25D 5/14 (2006.01); C25D 7/06 (2006.01); C25D 3/06 (2006.01); C25D 3/12 (2006.01)

CPC (source: EP US)

C25D 5/14 (2013.01 - EP US); C25D 7/0607 (2013.01 - EP US); C25D 7/0614 (2013.01 - EP); C25D 3/06 (2013.01 - EP)

Citation (applicant)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 3112502 A1 20170104; EP 3112502 B1 20180801

DOCDB simple family (application)

EP 16176105 A 20160624