EP 3121157 B1 20190320 - BONDED BODY, SUBSTRATE FOR POWER MODULES, POWER MODULE AND METHOD FOR PRODUCING BONDED BODY
Title (en)
BONDED BODY, SUBSTRATE FOR POWER MODULES, POWER MODULE AND METHOD FOR PRODUCING BONDED BODY
Title (de)
VERBUNDENER KÖRPER, SUBSTRAT FÜR LEISTUNGSMODULE, LEISTUNGSMODUL UND VERFAHREN ZUR HERSTELLUNG EINES VERBUNDENEN KÖRPERS
Title (fr)
CORPS LIÉ, SUBSTRAT POUR MODULES DE PUISSANCE, MODULE DE PUISSANCE ET PROCÉDÉ DE PRODUCTION D'UN CORPS LIÉ
Publication
Application
Priority
- JP 2014058869 A 20140320
- JP 2015052660 W 20150130
Abstract (en)
[origin: EP3121157A1] There is provided a bonded body of the invention in which a ceramic member formed of a ceramic containing Al and a Cu member formed of Cu or a Cu alloy are bonded to each other, in which a bonding portion is formed between the ceramic member and the Cu member, an active metal compound region formed of a compound containing active metal is formed on the bonded portion on the ceramic member side, and an Al concentration of the bonding portion having a thickness range of 0.5 µm to 3 µm from one surface of the active metal compound region on the Cu member side towards the Cu member side is in a range of 0.5 at% to 15 at%.
IPC 8 full level
C04B 37/02 (2006.01); H01L 23/13 (2006.01); H01L 23/36 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01)
CPC (source: EP KR US)
B23K 1/0016 (2013.01 - US); B23K 35/302 (2013.01 - EP US); C04B 37/026 (2013.01 - EP KR US); H01L 23/15 (2013.01 - EP US); H01L 23/3735 (2013.01 - EP US); H01L 25/07 (2013.01 - US); H01L 25/18 (2013.01 - US); H05K 1/181 (2013.01 - US); C04B 2235/656 (2013.01 - EP US); C04B 2235/6567 (2013.01 - EP US); C04B 2237/12 (2013.01 - KR); C04B 2237/121 (2013.01 - EP US); C04B 2237/122 (2013.01 - EP US); C04B 2237/124 (2013.01 - EP US); C04B 2237/126 (2013.01 - EP US); C04B 2237/127 (2013.01 - US); C04B 2237/128 (2013.01 - EP US); C04B 2237/343 (2013.01 - EP KR US); C04B 2237/366 (2013.01 - EP KR US); C04B 2237/402 (2013.01 - EP US); C04B 2237/407 (2013.01 - EP KR US); C04B 2237/60 (2013.01 - EP KR US); C04B 2237/708 (2013.01 - EP KR US); C04B 2237/72 (2013.01 - EP US); H01L 23/15 (2013.01 - KR); H01L 23/3735 (2013.01 - KR); H01L 24/29 (2013.01 - EP US); H01L 24/32 (2013.01 - EP US); H01L 24/83 (2013.01 - EP US); H01L 25/07 (2013.01 - KR); H01L 2224/29111 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/83101 (2013.01 - EP US); H05K 2201/10378 (2013.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3121157 A1 20170125; EP 3121157 A4 20171108; EP 3121157 B1 20190320; CN 105829266 A 20160803; JP 2015193526 A 20151105; JP 5871081 B2 20160301; KR 102300413 B1 20210908; KR 20160135177 A 20161125; TW 201541570 A 20151101; TW I619207 B 20180321; US 2017062305 A1 20170302; US 9735085 B2 20170815; WO 2015141295 A1 20150924
DOCDB simple family (application)
EP 15765052 A 20150130; CN 201580003060 A 20150130; JP 2015017670 A 20150130; JP 2015052660 W 20150130; KR 20167023026 A 20150130; TW 104103218 A 20150130; US 201515119547 A 20150130