Global Patent Index - EP 3123842 A1

EP 3123842 A1 20170201 - SECURELY ADHERING LAYER ON CERAMIC AND/OR SOLDERING RESIST AS PROTECTIVE LACQUER OR POTTING COMPOUND

Title (en)

SECURELY ADHERING LAYER ON CERAMIC AND/OR SOLDERING RESIST AS PROTECTIVE LACQUER OR POTTING COMPOUND

Title (de)

HAFTFESTE SCHICHT AUF KERAMIK UND/ODER LÖTSTOPPLACK ALS SCHUTZLACK ODER VERGUSSMASSE

Title (fr)

COUCHE ADHÉRENTE SUR CÉRAMIQUE ET/OU MASQUE ANTI-SOUDURE, EN TANT QUE VERNIS DE PROTECTION OU MASSE DE SCELLEMENT

Publication

EP 3123842 A1 20170201 (DE)

Application

EP 15712613 A 20150326

Priority

  • DE 102014205832 A 20140328
  • EP 2015056522 W 20150326

Abstract (en)

[origin: WO2015144810A1] The present invention relates to a securely adhering layer on ceramic and/or soldering resist which comprises a potting compound or a protective lacquer. The potting compound or the protective lacquer in this case is a plastics-based compound. In addition, the present invention relates to a method for producing such a securely adhering layer, in which method i) a ceramic substrate is roughened in an etching bath, ii) the ceramic substrate thus roughened is metallized by means of a metal paste, iii) the ceramic carrier thus metallized is processed to form a small ceramic chip with a housed LED or to form an open LED chip, iv) the housed LED or the open LED chip is connected to further electronic components on the metallized ceramic carrier, and v) a potting compound or a protective lacquer, which is a plastics-based compound, is applied to the carrier ceramic thus populated. Finally, the present invention also relates to a structural part having such a securely adhering layer.

IPC 8 full level

H05K 1/03 (2006.01); H01L 33/00 (2010.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01)

CPC (source: EP)

H05K 3/285 (2013.01); H01L 25/167 (2013.01); H01L 33/52 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/005 (2013.01); H05K 1/0306 (2013.01); H05K 3/284 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/0759 (2013.01)

Citation (search report)

See references of WO 2015144810A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

DE 102015205486 A1 20151001; EP 3123842 A1 20170201; TW 201545623 A 20151201; WO 2015144810 A1 20151001

DOCDB simple family (application)

DE 102015205486 A 20150326; EP 15712613 A 20150326; EP 2015056522 W 20150326; TW 104109951 A 20150327