EP 3127151 B1 20240501 - STACKED SEMICONDUCTOR DIE ASSEMBLY WITH A THERMALLY CONDUCTIVE CASING AND A METHOD OF MANUFACTURING SUCH AN ASSEMBLY

Title (en)

STACKED SEMICONDUCTOR DIE ASSEMBLY WITH A THERMALLY CONDUCTIVE CASING AND A METHOD OF MANUFACTURING SUCH AN ASSEMBLY

Title (de)

GESTAPELTE HALBLEITERCHIPANORDNUNG MIT EINEM WÄRMELEITENDEN GEHÄUSE UND VERFAHREN ZUR HERSTELLUNG SOLCH EINER ANORDNUNG

Title (fr)

ENSEMBLE DE PUCES SEMI-CONDUCTRICES EMPILÉES AVEC UN BOÎTIER THERMOCONDUCTEUR ET PROCÉDÉ DE FABRICATION D'UN TEL ENSEMBLE

Publication

EP 3127151 B1 20240501 (EN)

Application

EP 15773393 A 20150330

Priority

US 201414231101 A 20140331
US 2015023377 W 20150330

Abstract (en)

[origin: US2015279828A1] Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a stack of semiconductor dies and a thermally conductive casing at least partially enclosing the stack of semiconductor dies within an enclosure. A package substrate carries the thermally conductive casing, and an interposer is disposed between the thermally conductive casing and the stack of semiconductor dies. A peripheral portion of the interposer extends laterally beyond the stack of semiconductor dies and is coupled to a plurality of conductive members interposed between the peripheral portion and the package substrate.

IPC 8 full level

H01L 23/34 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/552 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01)

CPC (source: EP KR US)

H01L 23/3675 (2013.01 - KR); H01L 23/373 (2013.01 - KR US); H01L 23/5226 (2013.01 - KR US); H01L 24/17 (2013.01 - EP KR US); H01L 24/81 (2013.01 - KR US); H01L 25/0652 (2013.01 - KR US); H01L 25/0657 (2013.01 - EP KR US); H01L 25/18 (2013.01 - EP US); H01L 25/50 (2013.01 - EP KR US); H01L 23/3675 (2013.01 - EP US); H01L 23/3677 (2013.01 - EP US); H01L 23/49811 (2013.01 - EP US); H01L 23/49833 (2013.01 - EP US); H01L 24/13 (2013.01 - EP US); H01L 24/16 (2013.01 - EP US); H01L 24/32 (2013.01 - EP US); H01L 24/73 (2013.01 - EP US); H01L 24/92 (2013.01 - EP US); H01L 2224/13025 (2013.01 - EP US); H01L 2224/131 (2013.01 - EP US); H01L 2224/13111 (2013.01 - EP US); H01L 2224/13124 (2013.01 - EP US); H01L 2224/13147 (2013.01 - EP US); H01L 2224/13155 (2013.01 - EP US); H01L 2224/1329 (2013.01 - EP US); H01L 2224/133 (2013.01 - EP US); H01L 2224/16146 (2013.01 - EP US); H01L 2224/16227 (2013.01 - EP US); H01L 2224/17181 (2013.01 - EP US); H01L 2224/32145 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/73204 (2013.01 - EP US); H01L 2224/73253 (2013.01 - EP US); H01L 2224/92125 (2013.01 - EP US); H01L 2225/06513 (2013.01 - EP KR US); H01L 2225/06517 (2013.01 - EP KR US); H01L 2225/0652 (2013.01 - US); H01L 2225/06541 (2013.01 - EP KR US); H01L 2225/06565 (2013.01 - EP US); H01L 2225/06568 (2013.01 - EP US); H01L 2225/06589 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US); H01L 2924/1033 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/1431 (2013.01 - EP US); H01L 2924/1434 (2013.01 - EP US); H01L 2924/1436 (2013.01 - EP US); H01L 2924/1437 (2013.01 - EP US); H01L 2924/1438 (2013.01 - EP US); H01L 2924/15156 (2013.01 - EP US); H01L 2924/15192 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/15321 (2013.01 - EP US); H01L 2924/15331 (2013.01 - EP); H01L 2924/16152 (2013.01 - EP US); H01L 2924/16251 (2013.01 - EP US); H01L 2924/19041 (2013.01 - EP US); H01L 2924/19042 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US); H01L 2924/19105 (2013.01 - EP US)

C-Set (source: EP US)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

US 2015279828 A1 20151001; US 9269700 B2 20160223; CN 106104796 A 20161109; CN 106104796 B 20190104; EP 3127151 A1 20170208; EP 3127151 A4 20171004; EP 3127151 B1 20240501; JP 2017510076 A 20170406; JP 6339222 B2 20180606; KR 101915869 B1 20190107; KR 20160113201 A 20160928; TW 201601259 A 20160101; TW I553785 B 20161011; US 10461059 B2 20191029; US 2016141270 A1 20160519; WO 2015153481 A1 20151008

DOCDB simple family (application)

US 201414231101 A 20140331; CN 201580012756 A 20150330; EP 15773393 A 20150330; JP 2016559399 A 20150330; KR 20167023042 A 20150330; TW 104110528 A 20150331; US 2015023377 W 20150330; US 201615007615 A 20160127