EP 3128043 A1 20170208 - METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF ALPHA AMINO ACIDS AND BISEPOXIDES
Title (en)
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF ALPHA AMINO ACIDS AND BISEPOXIDES
Title (de)
VERFAHREN ZUM ELEKTROPLATTIEREN FOTOLACKDEFINIERTER MERKMALE AUS KUPFERPLATTIERBÄDERN MIT REAKTIONSPRODUKTEN AUS ALPHA-AMINOSÄUREN UND BISEPOXIDEN
Title (fr)
PROCÉDÉ D'ÉLECTRODÉPOSITION DE CARACTÉRISTIQUES DÉFINIES PHOTOSENSIBLES À PARTIR DE BAINS D'ÉLECTRODÉPOSITION DE CUIVRE CONTENANT DES PRODUITS DE RÉACTION DE BISÉPOXYDES ET ACIDES AMINÉS ALPHA
Publication
Application
Priority
US 201562201860 P 20150806
Abstract (en)
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of ±-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
IPC 8 full level
C25D 3/38 (2006.01); C25D 5/02 (2006.01); C25D 7/00 (2006.01)
CPC (source: CN EP KR US)
C07D 303/04 (2013.01 - KR); C25D 3/38 (2013.01 - CN EP KR US); C25D 5/022 (2013.01 - EP KR US); C25D 7/00 (2013.01 - CN EP KR US); C25D 7/123 (2013.01 - EP KR US); G03F 7/0002 (2013.01 - KR); H01L 21/0274 (2013.01 - KR); H01L 24/03 (2013.01 - US); H01L 24/06 (2013.01 - US); H01L 24/11 (2013.01 - US); H01L 24/14 (2013.01 - US); H05K 1/111 (2013.01 - US); H05K 3/064 (2013.01 - US); H05K 3/4007 (2013.01 - US); H01L 2224/03462 (2013.01 - US); H01L 2224/03472 (2013.01 - US); H01L 2224/05015 (2013.01 - US); H01L 2224/11 (2013.01 - EP US); H01L 2224/11472 (2013.01 - US); H01L 2224/13014 (2013.01 - US); H01L 2224/13147 (2013.01 - US); H05K 2201/09209 (2013.01 - US)
C-Set (source: EP US)
Citation (applicant)
- US 6610192 B1 20030826 - STEP EUGENE N [US], et al
- US 7128822 B2 20061031 - WANG DEYAN [US], et al
- US 7374652 B2 20080520 - HAYASHI SHINJIRO [JP], et al
- US 6800188 B2 20041005 - HAGIWARA HIDEKI [JP], et al
Citation (search report)
- [XA] US 2012043654 A1 20120223 - LU WEN-HSIUNG [TW], et al
- [XA] US 2013313011 A1 20131128 - HU DYI-CHUNG [TW], et al
- [A] JP 2008291287 A 20081204 - NIPPON NEW CHROME KK
- [A] WO 0043438 A1 20000727 - CIBA SC HOLDING AG [CH]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3128043 A1 20170208; EP 3128043 B1 20180411; CN 106435661 A 20170222; CN 106435661 B 20190219; JP 2017036501 A 20170216; JP 6322672 B2 20180509; KR 101799857 B1 20171122; KR 20170017738 A 20170215; TW 201715087 A 20170501; TW I618820 B 20180321; US 2017037527 A1 20170209; US 9932684 B2 20180403
DOCDB simple family (application)
EP 16182479 A 20160802; CN 201610619284 A 20160729; JP 2016150558 A 20160729; KR 20160097686 A 20160731; TW 105123888 A 20160728; US 201615220472 A 20160727