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Current content: 155 263 406 patent documents

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215 613 new documents added

1 342 057 documents amended

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EP 3134903 B1 20190612 - ALUMINIUM PASTES FOR THICK FILM HYBRIDES

Title (en)

ALUMINIUM PASTES FOR THICK FILM HYBRIDES

Title (de)

ALUMINIUMPASTE FÜR DICKFILMHYBRIDE

Title (fr)

PÂTE À L'ALUMINIUM POUR CIRCUITS HYBRIDES À COUCHES ÉPAISSES

Publication

EP 3134903 B1 20190612 (DE)

Application

EP 15720938 A 20150427

Priority

DE 102014207840 A 20140425
EP 2015059087 W 20150427

Abstract (en)

[origin: WO2015162298A1] The invention relates to aluminum-containing metallisation pastes for producing hybrid circuits on ceramic substrates.

IPC 8 full level

H01B 1/02 (2006.01); H01B 1/16 (2006.01)

CPC (source: EP)

H01B 1/023 (2013.01); H01B 1/16 (2013.01)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2015162298 A1 20151029; DE 102015207697 A1 20151029; EP 3134903 A1 20170301; EP 3134903 B1 20190612

DOCDB simple family (application)

EP 2015059087 W 20150427; DE 102015207697 A 20150427; EP 15720938 A 20150427