Global Patent Index - EP 3134903 B1

EP 3134903 B1 20190612 - ALUMINIUM PASTES FOR THICK FILM HYBRIDES

Title (en)

ALUMINIUM PASTES FOR THICK FILM HYBRIDES

Title (de)

ALUMINIUMPASTE FÜR DICKFILMHYBRIDE

Title (fr)

PÂTE À L'ALUMINIUM POUR CIRCUITS HYBRIDES À COUCHES ÉPAISSES

Publication

EP 3134903 B1 (DE)

Application

EP 15720938 A

Priority

  • DE 102014207840 A
  • EP 2015059087 W

Abstract (en)

[origin: WO2015162298A1] The invention relates to aluminum-containing metallisation pastes for producing hybrid circuits on ceramic substrates.

IPC 8 full level

H01B 1/02 (2006.01); H01B 1/16 (2006.01)

CPC (source: EP)

H01B 1/023 (2013.01); H01B 1/16 (2013.01)

Citation (examination)

None

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2015162298 A1 20151029; DE 102015207697 A1 20151029; EP 3134903 A1 20170301; EP 3134903 B1 20190612

DOCDB simple family (application)

EP 2015059087 W 20150427; DE 102015207697 A 20150427; EP 15720938 A 20150427