EP 3135044 B1 20190605 - LOUD SPEAKER ARRANGEMENT WITH CIRCUIT-BOARD-INTEGRATED ASIC
Title (en)
LOUD SPEAKER ARRANGEMENT WITH CIRCUIT-BOARD-INTEGRATED ASIC
Title (de)
LAUTSPRECHERANORDNUNG MIT LEITERPLATTENINTEGRIERTEM ASIC
Title (fr)
SYSTÈME DE HAUT-PARLEUR MUNI D'UN CIRCUIT ASIC INTÉGRÉ DANS UNE CARTE DE CIRCUIT IMPRIMÉ
Publication
Application
Priority
- DE 102014105754 A 20140424
- EP 2015058898 W 20150424
Abstract (en)
[origin: WO2015162248A1] The present invention relates to a loud speaker arrangement (1) with a circuit board (2), an MEMS loudspeaker (3) for producing sound waves in the audible wavelength spectrum, said MEMS loud speaker having a membrane (9) deflectable along a z-axis, a sound-conducting channel (21) adjacent to the MEMS loudspeaker (3) with an acoustic outlet opening (22) and an ASIC (4) electrically connected to the MEMS loudspeaker (3). Further, the circuit board (2) comprises a first circuit board cavity (11) in which the ASIC (4) is arranged so as to be fully integrated in the circuit board (2). Further, the circuit board (2) comprises a second circuit board cavity (13) with an opening (14), said opening being closed by means of the MEMS loudspeaker (3) so that the second circuit board cavity (13) forms at least one part of a cavity (15) of the MEMS loudspeaker (3). According to the invention, the sound-conducting channel (21) extends obliquely to the z-axis of the MEMS loudspeaker. Moreover, the acoustic outlet opening (22) is arranged on the lateral surface of the loudspeaker arrangement (1).
IPC 8 full level
H04R 3/00 (2006.01); H04R 19/02 (2006.01)
CPC (source: CN EP KR US)
H04R 3/00 (2013.01 - US); H04R 19/02 (2013.01 - EP KR US); H04R 19/04 (2013.01 - CN); H04R 2201/003 (2013.01 - CN EP KR US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2015162248 A1 20151029; AU 2015250799 A1 20161117; AU 2015250799 B2 20190404; CA 2946784 A1 20151029; CN 107027341 A 20170808; CN 107027341 B 20200313; DE 102014105754 A1 20151029; DE 102014105754 B4 20220210; EP 3135044 A1 20170301; EP 3135044 B1 20190605; KR 20160146952 A 20161221; SG 10201809403Y A 20181129; SG 11201608913Y A 20161129; US 10097927 B2 20181009; US 2017048624 A1 20170216
DOCDB simple family (application)
EP 2015058898 W 20150424; AU 2015250799 A 20150424; CA 2946784 A 20150424; CN 201580034429 A 20150424; DE 102014105754 A 20140424; EP 15719663 A 20150424; KR 20167032814 A 20150424; SG 10201809403Y A 20150424; SG 11201608913Y A 20150424; US 201515306203 A 20150424