EP 3141633 B1 20180502 - COPPER PLATING BATH COMPOSITION
Title (en)
COPPER PLATING BATH COMPOSITION
Title (de)
KUPFERPLATTIERUNGSBADZUSAMMENSETZUNG
Title (fr)
COMPOSITION DE BAIN DE PLACAGE DE CUIVRE
Publication
Application
Priority
EP 15184663 A 20150910
Abstract (en)
[origin: EP3141633A1] The present invention relates to aqueous acidic plating baths for copper deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and an additive obtainable by a reaction of at least one aminoglycidyl compound comprising at least one amino group which bears at least one glycidyl moiety and at least one second compound selected from ammonia and amine compounds wherein the amine compounds comprise at least one primary or secondary amino group with the proviso that the aminoglycidyl compound contains at least one polyoxyalkylene residue and / or the amine compound contains at least one polyoxyalkylene residue. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
IPC 8 full level
C25D 3/38 (2006.01); C25D 7/00 (2006.01); H05K 3/18 (2006.01)
CPC (source: EP US)
C25D 3/38 (2013.01 - EP US); C25D 3/58 (2013.01 - US); C25D 7/00 (2013.01 - EP US); C25D 7/12 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3141633 A1 20170315; EP 3141633 B1 20180502; ES 2681836 T3 20180917; TW 201718947 A 20170601; TW I722016 B 20210321; US 10633755 B2 20200428; US 2018237932 A1 20180823; WO 2017042334 A1 20170316
DOCDB simple family (application)
EP 15184663 A 20150910; EP 2016071309 W 20160909; ES 15184663 T 20150910; TW 105129248 A 20160909; US 201615754008 A 20160909