EP 3144413 B1 20180425 - PLATING BATH COMPOSITION FOR ELECTROLESS PLATING OF GOLD
Title (en)
PLATING BATH COMPOSITION FOR ELECTROLESS PLATING OF GOLD
Title (de)
GALVANISIERUNGSBADZUSAMMENSETZUNG ZUR STROMLOSEN GALVANISIERUNG VON GOLD
Title (fr)
COMPOSITION DE BAIN DE PLACAGE POUR UN DÉPÔT AUTOCATALYTIQUE D'OR
Publication
Application
Priority
EP 15186095 A 20150921
Abstract (en)
[origin: EP3144413A1] An electroless aqueous gold plating bath, comprising at least one source of gold ions and at least one reducing agent for gold ions, characterized in that it comprises at least one ethylenediamine derivative according to formula (I) wherein the residues R 1 and R 2 comprise 2 to 12 carbon atoms and are selected from the group consisting of branched alkyl, unbranched alkyl, cycloalkyl or combinations thereof wherein the individual residues R 1 and R 2 are the same or different as plating enhancer compound. The electroless aqueous gold plating bath is suitable to provide soft gold layers useful for wire bonding and soldering applications which are required for electronic components.
IPC 8 full level
C23C 18/44 (2006.01); C23C 18/18 (2006.01)
CPC (source: CN EP KR US)
C23C 18/1637 (2013.01 - CN); C23C 18/1844 (2013.01 - CN EP KR); C23C 18/44 (2013.01 - CN EP KR US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3144413 A1 20170322; EP 3144413 B1 20180425; CN 108026642 A 20180511; CN 116607132 A 20230818; JP 2018532046 A 20181101; JP 6930966 B2 20210901; KR 20180044923 A 20180503; TW 201720955 A 20170616; TW I709663 B 20201111; US 2020232099 A1 20200723; WO 2017050662 A1 20170330
DOCDB simple family (application)
EP 15186095 A 20150921; CN 201680052427 A 20160916; CN 202310280778 A 20160916; EP 2016072053 W 20160916; JP 2018515078 A 20160916; KR 20187006725 A 20160916; TW 105129251 A 20160909; US 201615758754 A 20160916