EP 3147942 B1 20200909 - SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE USING THE SAME AND MANUFACTURING METHOD THEREOF
Title (en)
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE USING THE SAME AND MANUFACTURING METHOD THEREOF
Title (de)
HALBLEITERGEHÄUSE, HALBLEITERBAUELEMENT DAMIT UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
BOÎTIER DE SEMI-CONDUCTEUR, DISPOSITIF À SEMI-CONDUCTEURS L'UTILISANT ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- US 201562221262 P 20150921
- US 201615162760 A 20160524
Abstract (en)
[origin: EP3147942A1] A semiconductor package includes a package substrate, a first electronic component and a second package body. The package substrate includes a first conductive layer, a first pillar layer, a first package body and a second conductive layer, wherein the first pillar layer is formed on the first conductive layer, the first package body encapsulates the first conductive layer and the first pillar layer, and the second conductive layer electrically connects to the first pillar layer. The first electronic component is disposed above the second conductive layer of the package substrate. The second package body encapsulates the first electronic component and the second conductive layer.
IPC 8 full level
H01L 25/065 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01); H01L 25/16 (2006.01)
CPC (source: CN EP US)
H01L 21/4846 (2013.01 - US); H01L 21/4853 (2013.01 - EP US); H01L 21/486 (2013.01 - US); H01L 21/561 (2013.01 - CN); H01L 21/565 (2013.01 - US); H01L 21/568 (2013.01 - EP US); H01L 23/145 (2013.01 - EP US); H01L 23/3114 (2013.01 - US); H01L 23/3121 (2013.01 - CN); H01L 23/49822 (2013.01 - CN); H01L 23/49827 (2013.01 - EP US); H01L 23/50 (2013.01 - EP US); H01L 23/5389 (2013.01 - EP US); H01L 25/0657 (2013.01 - EP US); H01L 25/10 (2013.01 - EP US); H01L 25/105 (2013.01 - EP US); H01L 25/16 (2013.01 - EP US); H01L 25/162 (2013.01 - EP US); H01L 25/165 (2013.01 - EP US); H01L 25/50 (2013.01 - US); H01L 23/3128 (2013.01 - EP US); H01L 23/49816 (2013.01 - EP US); H01L 24/13 (2013.01 - EP US); H01L 24/16 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/81 (2013.01 - EP US); H01L 2224/131 (2013.01 - EP US); H01L 2224/16227 (2013.01 - EP US); H01L 2224/16238 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/81005 (2013.01 - EP US); H01L 2225/1023 (2013.01 - EP US); H01L 2225/1041 (2013.01 - EP US); H01L 2225/1058 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/1533 (2013.01 - EP US); H01L 2924/1579 (2013.01 - EP US); H01L 2924/19041 (2013.01 - EP US); H01L 2924/19042 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US); H01L 2924/19106 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3147942 A1 20170329; EP 3147942 B1 20200909; CN 106548991 A 20170329; TW 201712813 A 20170401; TW I595605 B 20170811; US 10186488 B2 20190122; US 2017084541 A1 20170323; US 2017338183 A1 20171123; US 9761534 B2 20170912
DOCDB simple family (application)
EP 16175721 A 20160622; CN 201610614954 A 20160729; TW 105120336 A 20160628; US 201615162760 A 20160524; US 201715672440 A 20170809