EP 3149767 A4 20180124 - OPTICAL SYSTEM AND METHODS FOR THE DETERMINATION OF STRESS IN A SUBSTRATE
Title (en)
OPTICAL SYSTEM AND METHODS FOR THE DETERMINATION OF STRESS IN A SUBSTRATE
Title (de)
OPTISCHES SYSTEM UND VERFAHREN ZUR BESTIMMUNG VON SPANNUNGEN IN EINEM SUBSTRAT
Title (fr)
SYSTÈME OPTIQUE ET PROCÉDÉS DE DÉTERMINATION DE CONTRAINTES DANS UN SUBSTRAT
Publication
Application
Priority
- US 201462004663 P 20140529
- US 2015033022 W 20150528
Abstract (en)
[origin: WO2015184162A1] Methods and systems are disclosed for measuring multidimensional stress characteristics in a substrate. Generally, the methods include applying a sequence of optical pump pulses to the substrate. The optical pump pulses induce a propagating strain pulse in the substrate. Optical probe pulses are also applied. By analyzing transient optical responses caused by the propagating strain pulse, multidimensional stress components characterizing the stress in the substrate can be determined. Multidimensional stress components may also be determined at a depth of a substrate. Multidimensional stress components may also be determined at areas adjacent a through-silicon via.
IPC 8 full level
H01L 21/66 (2006.01); G01B 11/16 (2006.01); G01L 1/24 (2006.01); G01L 5/16 (2006.01); G01N 29/24 (2006.01)
CPC (source: EP US)
G01B 11/16 (2013.01 - EP US); G01L 1/24 (2013.01 - US); G01L 1/241 (2013.01 - EP US); G01L 5/166 (2013.01 - EP US); H01L 22/12 (2013.01 - EP US)
Citation (search report)
- [XI] US 6175416 B1 20010116 - MARIS HUMPHREY J [US], et al
- [XI] US 6208418 B1 20010327 - MARIS HUMPHREY J [US]
- [I] US 4710030 A 19871201 - TAUC JAN [US], et al
- [A] JP 2009014606 A 20090122 - HITACHI LTD
- See references of WO 2015184162A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2015184162 A1 20151203; CN 106796899 A 20170531; CN 106796899 B 20191105; EP 3149767 A1 20170405; EP 3149767 A4 20180124; TW 201602536 A 20160116; TW I688755 B 20200321; US 10113861 B2 20181030; US 2017199027 A1 20170713
DOCDB simple family (application)
US 2015033022 W 20150528; CN 201580035568 A 20150528; EP 15798838 A 20150528; TW 104117197 A 20150528; US 201515313897 A 20150528