EP 3150744 A1 20170405 - ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY LAYER, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY LAYER, SUBSTRATE COMPRISING SAID ALLOY LAYER AND USES OF THE COATED SUBSTRATE
Title (en)
ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY LAYER, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY LAYER, SUBSTRATE COMPRISING SAID ALLOY LAYER AND USES OF THE COATED SUBSTRATE
Title (de)
GALVANIKBAD ZUR ELEKTROCHEMISCHEN ABSCHEIDUNG EINER CU-SN-ZN-PD LEGIERUNGSSCHICHT, VERFAHREN ZUR ELEKTROCHEMISCHEN ABSCHEIDUNG DER LEGIERUNGSSCHICHT, SUBSTRAT MIT DER LEGIERUNGSSCHICHT UND VERWENDUNGEN DES BESCHICHTETEN SUBSTRATS
Title (fr)
BAIN GALVANIQUE POUR LE DÉPÔT ÉLECTROCHIMIQUE D'UNE COUCHE D'ALLIAGE CU-SN-ZN-PD, PROCÉDÉ DE DÉPÔT ÉLECTROCHIMIQUE DE CETTE COUCHE D'ALLIAGE, SUBSTRAT COMPRENANT CETTE COUCHE D'ALLIAGE ET UTILISATIONS DU SUBSTRAT REVÊTU
Publication
Application
Priority
EP 15187511 A 20150930
Abstract (en)
The invention provides an electroplating bath for electrochemical deposition of a novel Cu-Sn-Zn-Pd alloy on a substrate. The novel alloy is characterized by exceptional corrosion resistance and the commonly used precious metal intermediate layer (e.g. a Pd-layer) between the substrate and the finishing layer is no longer necessary which allows a substantial reduction of the production costs of the plated substrates.
IPC 8 full level
C22C 9/02 (2006.01)
CPC (source: EP US)
C22C 9/02 (2013.01 - EP); C25D 3/58 (2013.01 - EP US); C25D 3/60 (2013.01 - EP); C25D 5/10 (2013.01 - EP US); C25D 5/611 (2020.08 - EP US); C25D 5/627 (2020.08 - EP US); C25D 7/005 (2013.01 - EP)
Citation (applicant)
- EP 1930478 B1 20130619 - ENTHONE [US]
- EP 2035602 B1 20120321 - BYD CO LTD [CN]
- EP 2757180 A1 20140723 - VALMET S P A [IT]
- CN 1175287 A 19980304 - CITIZEN WATCH CO LTD [JP]
Citation (search report)
- [X] JP 3029948 B2 20000410
- [A] EP 2799595 A1 20141105 - DELPHI TECH INC [US]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3150744 A1 20170405; EP 3150744 B1 20200212; CN 108138346 A 20180608; CN 108138346 B 20210305; EP 3356579 A1 20180808; EP 3356579 B1 20200311; ES 2790583 T3 20201028; ES 2791197 T3 20201103; PT 3150744 T 20200512; PT 3356579 T 20200616; WO 2017055553 A1 20170406
DOCDB simple family (application)
EP 15187511 A 20150930; CN 201680056531 A 20160930; EP 16778284 A 20160930; EP 2016073427 W 20160930; ES 15187511 T 20150930; ES 16778284 T 20160930; PT 15187511 T 20150930; PT 16778284 T 20160930