EP 3150744 B1 20200212 - ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY LAYER, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY LAYER, SUBSTRATE COMPRISING SAID ALLOY LAYER AND USES OF THE COATED SUBSTRATE
Title (en)
ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY LAYER, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY LAYER, SUBSTRATE COMPRISING SAID ALLOY LAYER AND USES OF THE COATED SUBSTRATE
Title (de)
GALVANIKBAD ZUR ELEKTROCHEMISCHEN ABSCHEIDUNG EINER CU-SN-ZN-PD LEGIERUNGSSCHICHT, VERFAHREN ZUR ELEKTROCHEMISCHEN ABSCHEIDUNG DER LEGIERUNGSSCHICHT, SUBSTRAT MIT DER LEGIERUNGSSCHICHT UND VERWENDUNGEN DES BESCHICHTETEN SUBSTRATS
Title (fr)
BAIN GALVANIQUE POUR LE DÉPÔT ÉLECTROCHIMIQUE D'UNE COUCHE D'ALLIAGE CU-SN-ZN-PD, PROCÉDÉ DE DÉPÔT ÉLECTROCHIMIQUE DE CETTE COUCHE D'ALLIAGE, SUBSTRAT COMPRENANT CETTE COUCHE D'ALLIAGE ET UTILISATIONS DU SUBSTRAT REVÊTU
Publication
Application
Priority
EP 15187511 A 20150930
Abstract (en)
[origin: EP3150744A1] The invention provides an electroplating bath for electrochemical deposition of a novel Cu-Sn-Zn-Pd alloy on a substrate. The novel alloy is characterized by exceptional corrosion resistance and the commonly used precious metal intermediate layer (e.g. a Pd-layer) between the substrate and the finishing layer is no longer necessary which allows a substantial reduction of the production costs of the plated substrates.
IPC 8 full level
C22C 9/02 (2006.01)
CPC (source: EP US)
C22C 9/02 (2013.01 - EP); C25D 3/58 (2013.01 - EP US); C25D 3/60 (2013.01 - EP); C25D 5/10 (2013.01 - EP US); C25D 5/611 (2020.08 - EP US); C25D 5/627 (2020.08 - EP US); C25D 7/005 (2013.01 - EP)
Citation (examination)
- WO 2017021916 A2 20170209 - BLUCLAD S R L [IT]
- JP 2977503 B2 19991115
- US 6780527 B2 20040824 - NAOI KOICHI [JP], et al
Citation (opposition)
Opponent : BLUCLAD S.p.A.
- JP H06293990 A 19941021 - NIPPON SHINKINZOKU KAKO KK
- EP 2799595 A1 20141105 - DELPHI TECH INC [US]
- WO 2017021916 A2 20170209 - BLUCLAD S R L [IT]
- JP H10219467 A 19980818 - BIKUTORIA KK
- US 6780527 B2 20040824 - NAOI KOICHI [JP], et al
- BE 805602 A 19740201 - JOHNSON MATTHEY CO LTD
- US 3440151 A 19690422 - DUVA ROBERT, et al
- US 2014055026 A1 20140227 - HUTIN OLIVIER [DE], et al
- US 5972526 A 19991026 - MATSUMOTO YOSUKE [JP], et al
- WO 2015039152 A1 20150326 - W GARHÖFER GES M B H ING [AT]
- DEPOTO ET AL.: "White Bronze, Copper-Tin-Zinc Tri-metal: Expanding Applications and New Developments in a Changing Landscape", 20 May 2013 (2013-05-20), XP055142805, Retrieved from the Internet <URL:https://www.pfonline.com/articles/white-bronze-copper-tin-zinc-tri-metal-expanding-applications-and-new-developments-in-a-changing-landscape>
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3150744 A1 20170405; EP 3150744 B1 20200212; CN 108138346 A 20180608; CN 108138346 B 20210305; EP 3356579 A1 20180808; EP 3356579 B1 20200311; ES 2790583 T3 20201028; ES 2791197 T3 20201103; PT 3150744 T 20200512; PT 3356579 T 20200616; WO 2017055553 A1 20170406
DOCDB simple family (application)
EP 15187511 A 20150930; CN 201680056531 A 20160930; EP 16778284 A 20160930; EP 2016073427 W 20160930; ES 15187511 T 20150930; ES 16778284 T 20160930; PT 15187511 T 20150930; PT 16778284 T 20160930