Title (en)

COPPER-NICKEL-SILICON ALLOYS

Title (de)

KUPFER-NICKEL-SILIZIUM-LEGIERUNGEN

Title (fr)

ALLIAGES DE CUIVRE-NICKEL-SILICIUM

Publication

EP 3158095 A4 20170426 (EN)

Application

EP 08864853 A 20081219

Priority

• US 1644107 P 20071221
• US 4490008 P 20080414
• US 33673108 A 20081217
• US 2008087705 W 20081219

Abstract (en)

[origin: WO2009082695A1] A copper base alloy having an improved combination of yield strength and electrical conductivity consisting essentially of between about 1.0 and about 6.0 weight percent Ni, up to about 3.0 weight percent Co, between about 0.5 and about 2.0 weight percent Si, between about 0.01 and about 0.5 weight percent Mg, up to about 1.0 weight percent Cr, up to about 1.0 weight percent Sn, and up to about 1.0 weight percent Mn, the balance being copper and impurities, the alloy processed to have a yield strength of at least about 137ksi, and an electrical conductivity of at least about 25% IACS.

IPC 8 full level

C22C 9/06 (2006.01); C22C 9/10 (2006.01); C22F 1/08 (2006.01)

CPC (source: EP US)

C22C 9/06 (2013.01 - EP US); C22F 1/08 (2013.01 - EP US)

Citation (search report)

• [XA] US 2004079456 A1 20040429 - MANDIGO FRANK N [US], et al
• [XA] US 4728372 A 19880301 - CARON RONALD N [US], et al
• [XA] US 4594221 A 19860610 - CARON RONALD N [US], et al
• See references of WO 2009082695A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2009082695 A1 20090702; WO 2009082695 A9 20090924; CA 2710311 A1 20090702; CN 101939452 A 20110105; EP 3158095 A1 20170426; EP 3158095 A4 20170426; EP 3158095 B1 20180502; ES 2670425 T3 20180530; JP 2011508081 A 20110310; KR 20100120644 A 20101116; MX 2010006990 A 20101202; TW 200936786 A 20090901; TW I461548 B 20141121; US 2009183803 A1 20090723

DOCDB simple family (application)

US 2008087705 W 20081219; CA 2710311 A 20081219; CN 200880125280 A 20081219; EP 08864853 A 20081219; ES 08864853 T 20081219; JP 2010539878 A 20081219; KR 20107016153 A 20081219; MX 2010006990 A 20081219; TW 97149976 A 20081219; US 33673108 A 20081217