EP 3166142 A1 20170510 - BOND WIRE CONNECTION AND METHOD OF MANUFACTURING THE SAME
Title (en)
BOND WIRE CONNECTION AND METHOD OF MANUFACTURING THE SAME
Title (de)
BONDDRAHTVERBINDUNG UND VERFAHREN ZU DESSEN HERSTELLUNG
Title (fr)
CONNEXION PAR FIL DE CONNEXION ET MÉTHODE DE SA PRODUCTION
Publication
Application
Priority
EP 15193403 A 20151106
Abstract (en)
An integrated circuit package is provided. The integrated circuit package comprises: a die (201); a lead (202); and a bond wire (205) comprising a first end coupled to the die (201) and a second end coupled to the lead (202) via bond (206). The bond wire (205) further comprises: a first portion (251) between a first bend (252) in the bond wire (205) and the bond (206) and forming a first angle with respect to the lead (202); and a second portion (253) forming a second angle with respect to the lead (202). The first bend (252) is immediately between the first (251) and second (253) portions and is configured to reduce the angle of the bond wire (205) with respect to the lead (202) from the second angle to the first angle.
IPC 8 full level
H01L 23/49 (2006.01); H01L 21/60 (2006.01); H01L 23/495 (2006.01)
CPC (source: CN EP US)
H01L 21/4825 (2013.01 - US); H01L 21/565 (2013.01 - US); H01L 23/3114 (2013.01 - US); H01L 23/49503 (2013.01 - US); H01L 23/4952 (2013.01 - EP US); H01L 23/49541 (2013.01 - US); H01L 23/535 (2013.01 - CN); H01L 24/43 (2013.01 - CN); H01L 24/48 (2013.01 - EP US); H01L 24/85 (2013.01 - EP US); H01L 2224/32245 (2013.01 - EP US); H01L 2224/48095 (2013.01 - EP US); H01L 2224/48245 (2013.01 - US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/48465 (2013.01 - EP US); H01L 2224/48472 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2224/85047 (2013.01 - US); H01L 2224/85181 (2013.01 - EP US); H01L 2224/85205 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H01L 2924/3512 (2013.01 - EP US); H01L 2924/386 (2013.01 - EP US)
Citation (search report)
- [X] US 2005173791 A1 20050811 - HSU CHIN-TENG [TW], et al
- [XI] US 2010176500 A1 20100715 - HISHIOKA MAIKO [JP]
- [A] US 6176416 B1 20010123 - TSAI YU-FANG [TW], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3166142 A1 20170510; EP 3166142 B1 20210721; CN 107039398 A 20170811; CN 107039398 B 20211130; US 2017133342 A1 20170511
DOCDB simple family (application)
EP 15193403 A 20151106; CN 201610945981 A 20161102; US 201615339594 A 20161031