EP 3170924 A1 20170524 - ELECTROLYTE AND METHOD FOR ELECTROLYTIC DEPOSITION OF GOLD-COPPER ALLOYS
Title (en)
ELECTROLYTE AND METHOD FOR ELECTROLYTIC DEPOSITION OF GOLD-COPPER ALLOYS
Title (de)
ELEKTROLYT UND VERFAHREN ZUR ELEKTROLYTISCHEN ABLAGERUNG VON GOLD-KUPFER-LEGIERUNGEN
Title (fr)
ÉLECTROLYTE ET PROCÉDÉ POUR LE DÉPÔT ÉLECTROLYTIQUE D'ALLIAGES OR-CUIVRE
Publication
Application
Previously filed application
07007963 20070419 EP
Priority
- EP 16197251 A 20070419
- EP 07007963 A 20070419
Abstract (en)
This invention relates to an electrolyte as well as a method for the deposition of a gold-copper alloy on a substrate surface. With the electrolyte and method disclosed, deposition of gold-copper alloys with a value of carat in the range of 12 to 19 kt is possible. Beneath a source of gold and copper, the inventive electrolyte comprises potassium cyanate (KCN) in a concentration capable to maintain a copper to KCN ratio in the range of 3 to 7, and at least one complexing agent of the group consisting of ethylenediamine tetraacetic acid, diethylenetriamine pentaacetic acid, nitrilo-triacetic acid, ethylenediamine tetraacetic acid [EDTA], diethylenetriamine pentaacetic acid and nitrilotriacetic acid [NTA] Hydroxyethyl imino diacetic acid [HEIDA], nitrilo propionic diacetic acid [NPDA], imino diacetic acid [IDA], nitrilo trimethylphosphoric acid [NTMA, Dequest 2000], triethanol amine [TEA].
IPC 8 full level
CPC (source: EP)
Citation (search report)
- [XY] EP 0193848 A1 19860910 - EMMENEGGER HEINZ
- [XY] GB 1375611 A 19741127
- [XY] GB 2053276 A 19810204 - ALIPRANDINI P
Designated contracting state (EPC)
CH IT LI
DOCDB simple family (publication)
EP 1983077 A1 20081022; EP 1983077 B1 20161228; CN 101289756 A 20081022; CN 101289756 B 20120620; EP 3170924 A1 20170524
DOCDB simple family (application)
EP 07007963 A 20070419; CN 200810093471 A 20080421; EP 16197251 A 20070419