EP 3178969 B1 20200101 - COPPER-TIN ALLOY PLATING BATH
Title (en)
COPPER-TIN ALLOY PLATING BATH
Title (de)
KUPFER-ZINN-LEGIERUNGSPLATTIERUNGSBAD
Title (fr)
BAIN DE PLACAGE D'ALLIAGE DE CUIVRE-ÉTAIN
Publication
Application
Priority
- JP 2014162294 A 20140808
- JP 2015071330 W 20150728
Abstract (en)
[origin: EP3178969A1] An object of this invention is to provide a copper-tin alloy plating bath that allows for film thickening without using cyanide ions, and that can also be applied to barrel plating. This invention relates to a copper-tin alloy plating bath comprising an aqueous solution containing a water-soluble copper compound, a water-soluble divalent tin compound, a sulfur-containing compound represented by formula (1): €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒR-(CH 2 ) 1 -S-(CH 2 ) m -S-(CH 2 ) n -R€ƒ€ƒ€ƒ€ƒ€ƒ(1), wherein R is H, OH, or SO 3 Na, and 1, m, and n are each independently an integer of 0 to 3, and a hydroxyl group-containing aromatic compound.
IPC 8 full level
CPC (source: EP US)
C22C 9/02 (2013.01 - EP US); C25D 3/58 (2013.01 - EP US); C25D 3/60 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3178969 A1 20170614; EP 3178969 A4 20171227; EP 3178969 B1 20200101; CA 2957587 A1 20160211; CA 2957587 C 20190305; CN 106661752 A 20170510; CN 106661752 B 20210810; HK 1232261 A1 20180105; JP 6048712 B2 20161221; JP WO2016021439 A1 20170427; TW 201612362 A 20160401; TW I641729 B 20181121; US 2017204528 A1 20170720; WO 2016021439 A1 20160211
DOCDB simple family (application)
EP 15829133 A 20150728; CA 2957587 A 20150728; CN 201580038971 A 20150728; HK 17105769 A 20170612; JP 2015071330 W 20150728; JP 2015559750 A 20150728; TW 104125247 A 20150804; US 201515326328 A 20150728