EP 3180967 A1 20170621 - CIRCUIT BOARD WITH A HEAT-CONDUCTING ELEMENT
Title (en)
CIRCUIT BOARD WITH A HEAT-CONDUCTING ELEMENT
Title (de)
SCHALTUNGSTRÄGER MIT EINEM WÄRMELEITELEMENT
Title (fr)
SUPPORT DE CIRCUIT MUNI D'UN ÉLÉMENT CONDUCTEUR DE CHALEUR
Publication
Application
Priority
- DE 102014216194 A 20140814
- EP 2015064027 W 20150623
Abstract (en)
[origin: WO2016023663A1] The invention relates to a circuit board having at least one electrically insulating layer and at least one electrically conductive layer. The circuit board has at least one heat-conducting element which is embedded in the electrically insulating layer and which is of thermally conductive form. The heat-conducting element is designed to transport heat losses transversely with respect to an areal extent of the circuit board. According to the invention, the heat-conducting element has at least two sub-elements formed in each case by a metal body. The heat-conducting element has an electrically insulating connecting layer which is arranged between the sub-elements and which is designed to electrically insulate the sub-elements with respect to one another and connect the sub-elements to one another in thermally conductive fashion.
IPC 8 full level
H05K 1/02 (2006.01)
CPC (source: CN EP US)
H01L 23/367 (2013.01 - US); H05K 1/0204 (2013.01 - CN EP US); H05K 1/0206 (2013.01 - EP US); H05K 1/0209 (2013.01 - CN EP US); H05K 1/021 (2013.01 - US); H05K 1/0271 (2013.01 - US); H05K 1/181 (2013.01 - US); H05K 1/0206 (2013.01 - CN); H05K 2201/066 (2013.01 - CN EP US); H05K 2201/09063 (2013.01 - CN EP US)
Citation (search report)
See references of WO 2016023663A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102014216194 B3 20151210; CN 106576423 A 20170419; CN 106576423 B 20190816; EP 3180967 A1 20170621; US 10117323 B2 20181030; US 2017280552 A1 20170928; WO 2016023663 A1 20160218
DOCDB simple family (application)
DE 102014216194 A 20140814; CN 201580043512 A 20150623; EP 15734593 A 20150623; EP 2015064027 W 20150623; US 201515503976 A 20150623