Global Patent Index - EP 3187322 A1

EP 3187322 A1 20170705 - USE OF PRINTED ELECTRONICS ON PAPER TO EMBED A CIRCUIT INTO PLASTIC MOULDED OBJECTS

Title (en)

USE OF PRINTED ELECTRONICS ON PAPER TO EMBED A CIRCUIT INTO PLASTIC MOULDED OBJECTS

Title (de)

VERWENDUNG VON GEDRUCKTER ELEKTRONIK AUF PAPIER ZUM EINBETTEN EINER SCHALTUNG IN KUNSTSTOFFFORMTEILE

Title (fr)

UTILISATION DE DISPOSITIFS ÉLECTRONIQUES IMPRIMÉS SUR PAPIER POUR INTÉGRER UN CIRCUIT DANS DES OBJETS MOULÉS EN PLASTIQUE

Publication

EP 3187322 A1 20170705 (EN)

Application

EP 15307198 A 20151231

Priority

EP 15307198 A 20151231

Abstract (en)

The invention relates to a method to embed a label essentially consisting of a paper substrate carrying electronic inks and/or a printed electronic circuit and/or device (thereby achieving a paper-based circuit) directly into a moulded plastic piece (also designated as plastic object), the embedding of the paper-based circuit and the production of the plastic piece being performed in a single operation. The invention thus also relates to a method to manufacture plastic objects embedding such label. The invention also concerns a plastic object encompassing a label essentially consisting of a paper substrate carrying electronic inks and/or a printed electronic circuit and/or device (thereby achieving a paper-based circuit) embedded in the moulded plastic and in particular an object obtained by the method disclosed to prepare a moulded plastic piece.

IPC 8 full level

B29C 45/14 (2006.01); B29L 31/34 (2006.01)

CPC (source: EP KR US)

B29C 45/0001 (2013.01 - EP); B29C 45/14639 (2013.01 - US); B29C 45/14778 (2013.01 - KR); B29C 45/14811 (2013.01 - EP US); H01Q 1/38 (2013.01 - US); H05K 1/0386 (2013.01 - EP KR US); H05K 1/095 (2013.01 - US); H05K 3/12 (2013.01 - US); H05K 3/284 (2013.01 - EP KR US); H05K 3/285 (2013.01 - US); H05K 5/065 (2013.01 - US); B29C 45/14639 (2013.01 - EP); B29C 2045/14852 (2013.01 - EP KR US); B29C 2045/14918 (2013.01 - EP KR); B29K 2711/12 (2013.01 - EP KR); B29K 2711/123 (2013.01 - US); B29L 2031/3425 (2013.01 - EP KR US); H05K 2201/0129 (2013.01 - US); H05K 2201/0145 (2013.01 - US); H05K 2201/10098 (2013.01 - EP KR US); H05K 2203/1316 (2013.01 - EP KR US); H05K 2203/1327 (2013.01 - US)

Citation (applicant)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

WO 2017085085 A1 20170526; CA 3001943 A1 20170526; CN 108463326 A 20180828; EP 3187322 A1 20170705; EP 3377293 A1 20180926; EP 3377293 B1 20210519; ES 2879662 T3 20211122; JP 2018537312 A 20181220; KR 20180084927 A 20180725; RU 2018112971 A 20191218; US 11052584 B2 20210706; US 2020254662 A1 20200813

DOCDB simple family (application)

EP 2016077784 W 20161115; CA 3001943 A 20161115; CN 201680067011 A 20161115; EP 15307198 A 20151231; EP 16797855 A 20161115; ES 16797855 T 20161115; JP 2018525353 A 20161115; KR 20187017145 A 20161115; RU 2018112971 A 20161115; US 201615776192 A 20161115