EP 3191249 A1 20170719 - METHOD FOR SHORTENING THE PROCESS TIME DURING THE SOLDERING OF ELECTRIC OR ELECTRONIC COMPONENTS BY MEANS OF ELECTROMAGNETIC INDUCTION HEATING
Title (en)
METHOD FOR SHORTENING THE PROCESS TIME DURING THE SOLDERING OF ELECTRIC OR ELECTRONIC COMPONENTS BY MEANS OF ELECTROMAGNETIC INDUCTION HEATING
Title (de)
VERFAHREN ZUR PROZESSZEITVERKÜRZUNG BEIM LÖTEN ELEKTRISCHER ODER ELEKTRONISCHER BAUTEILE MITTELS ELEKTROMAGNETISCHER INDUKTIONSERWÄRMUNG
Title (fr)
PROCÉDÉ DE RACCOURCISSEMENT DES DURÉES DE TRAITEMENT LORS DU BRASAGE DE COMPOSANTS ÉLECTRIQUES OU ÉLECTRONIQUES AU MOYEN D'UN CHAUFFAGE PAR INDUCTION ÉLECTROMAGNÉTIQUE
Publication
Application
Priority
- DE 102014013553 A 20140912
- DE 102015003086 A 20150311
- EP 2015070730 W 20150910
Abstract (en)
[origin: WO2016038144A1] The invention relates to a method for shortening the process time during the soldering of electric or electronic components by means of electromagnetic induction heating, in particular the soldering of electric contact elements to solder connection surfaces that are applied to a non-metallic substrate, in particular a pane of glass. According to the invention, an electric contact element is first produced, designed as a solder foot, made of a material with an iron-nickel or iron-chromium alloy base. Subsequently, a lead-free connecting material is applied to the solder foot. After the solder foot has been positioned on the respective solder connection surface, the solder foot is inductively heated by means of high frequency energy with increased heating of the solder foot material and reduced heating of the silver-containing material of the respective solder connection surface. The soldering stage is completed after a time of <10 s, in particular within a time of <4 to 6s. The invention also relates to a contact element in the form of a special solder foot.
IPC 8 full level
B23K 1/00 (2006.01); B23K 1/002 (2006.01); B23K 1/19 (2006.01); H01R 4/02 (2006.01); B23K 103/00 (2006.01); B23K 103/04 (2006.01)
CPC (source: CN EP US)
B23K 1/0016 (2013.01 - CN EP US); B23K 1/002 (2013.01 - CN EP US); B23K 1/19 (2013.01 - CN EP US); B23K 35/262 (2013.01 - EP US); B23K 35/264 (2013.01 - EP US); H01R 4/02 (2013.01 - EP US); H01R 43/0207 (2013.01 - CN EP US); H05B 3/84 (2013.01 - EP US); B23K 2103/04 (2018.07 - CN EP US); B23K 2103/05 (2018.07 - EP US); B23K 2103/54 (2018.07 - CN EP US); H01R 12/57 (2013.01 - CN EP US); H05B 2203/016 (2013.01 - EP US)
Citation (search report)
See references of WO 2016038144A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 202015002764 U1 20150506; CN 107073617 A 20170818; DE 102015003086 A1 20160317; EP 3191249 A1 20170719; MX 2017003154 A 20180115; US 2017297130 A1 20171019; WO 2016038144 A1 20160317
DOCDB simple family (application)
DE 202015002764 U 20150311; CN 201580055265 A 20150910; DE 102015003086 A 20150311; EP 15763876 A 20150910; EP 2015070730 W 20150910; MX 2017003154 A 20150910; US 201515509534 A 20150910