Global Patent Index - EP 3191312 B1

EP 3191312 B1 20231220 - DEVICE FOR PARTIAL EMBOSSING OF SEALING LIDS AND METHOD FOR PARTIAL EMBOSSING OF SEALING LIDS

Title (en)

DEVICE FOR PARTIAL EMBOSSING OF SEALING LIDS AND METHOD FOR PARTIAL EMBOSSING OF SEALING LIDS

Title (de)

VORRICHTUNG ZUM TEILWEISEN PRÄGEN VON DECKELN UND VERFAHREN ZUM TEILWEISEN PRÄGEN VON DECKELN

Title (fr)

DISPOSITIF D'ESTAMPAGE PARTIEL D'OPERCULES ET PROCÉDÉ D'ESTAMPAGE PARTIEL D'OPERCULES

Publication

EP 3191312 B1 20231220 (DE)

Application

EP 15763835 A 20150908

Priority

  • EP 14003089 A 20140908
  • EP 2015001805 W 20150908

Abstract (en)

[origin: WO2016037697A1] The device for embossing part of an area of and punching out of sealing blanks from a film strip comprises an embossing tool and an adjacently arranged punching tool. The embossing tool in turn comprises a female and a male die (1), wherein the male die has three-dimensional elements (7) arranged in an outer area (3) and in a central area (5), and the male die and female die are pivotably mounted in a spatial position about an axis A standing substantially perpendicular in relation to the film strip. Alternatively, the female die can be exchanged for an elastic medium. The elastic medium is preferably not pivotably mounted.

IPC 8 full level

B44B 5/00 (2006.01); B65D 77/20 (2006.01)

CPC (source: EP US)

B21D 35/001 (2013.01 - US); B21D 43/22 (2013.01 - US); B44B 5/0004 (2013.01 - EP US); B44B 5/0019 (2013.01 - US); B65B 7/2807 (2013.01 - US); B65D 77/20 (2013.01 - EP US); B65D 77/2024 (2013.01 - EP US)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 2993058 A1 20160309; EP 3191312 A1 20170719; EP 3191312 B1 20231220; US 2017282234 A1 20171005; WO 2016037697 A1 20160317

DOCDB simple family (application)

EP 14003089 A 20140908; EP 15763835 A 20150908; EP 2015001805 W 20150908; US 201515509104 A 20150908