EP 3195705 A2 20170726 - METHOD FOR PRODUCING A DEFORMABLE PRINTED-CIRCUIT SUBSTRATE, AND DEFORMABLE PRINTED-CIRCUIT SUBSTRATE
Title (en)
METHOD FOR PRODUCING A DEFORMABLE PRINTED-CIRCUIT SUBSTRATE, AND DEFORMABLE PRINTED-CIRCUIT SUBSTRATE
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES UMGEFORMTEN SCHALTUNGSTRÄGERS, SOWIE UMGEFORMTER SCHALTUNGSTRÄGER
Title (fr)
PROCÉDÉ DE FABRICATION D'UN SUPPORT DE CIRCUIT DÉFORMÉ, ET SUPPORT DE CIRCUIT DÉFORMÉ
Publication
Application
Priority
- DE 102014013564 A 20140918
- IB 2015002186 W 20150918
Abstract (en)
[origin: WO2016042414A2] The invention relates to a method for producing a deformable printed-circuit substrate in the form of a laminate consisting of an adhesion promoter film (1), optionally an adhesive layer (2), a printed-circuit film substrate (3) and a purely metallic conductor track (4), the latter having a preferred thickness of the order of magnitude of 1000 atomic layers. The invention also relates to a deformable printed-circuit substrate (1-4). In the method according to the invention, the printed-circuit substrate (1-4) is shaped by means of a gaseous pressure medium, at a temperature above the glass transition temperature and below the melting temperature of the printed-circuit film substrate (3) being shaped, under a sudden, high gas pressure. Thanks to the invention, sharply deformed printed-circuit substrates, in particular freely or spherically shaped printed-circuit substrates can be produced, even with purely metallic conductor tracks. Optional back-moulding (9) and application of decorative layers (11) and/or coating layers (10) allow producing multifunctional, seamlessly and freely shaped plastic components with integrated electronic elements.
IPC 8 full level
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01)
CPC (source: EP)
H05K 1/0284 (2013.01); H05K 1/189 (2013.01); H05K 3/0014 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0158 (2013.01); H05K 2201/09018 (2013.01); H05K 2203/1545 (2013.01)
Citation (search report)
See references of WO 2016042414A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102014013564 A1 20160324; EP 3195705 A2 20170726; WO 2016042414 A2 20160324; WO 2016042414 A3 20160512
DOCDB simple family (application)
DE 102014013564 A 20140918; EP 15816863 A 20150918; IB 2015002186 W 20150918