Global Patent Index - EP 3198054 C0

EP 3198054 C0 20230607 - SURFACE TREATMENT OF METAL SUBSTRATES

Title (en)

SURFACE TREATMENT OF METAL SUBSTRATES

Title (de)

OBERFLÄCHENBEHANDLUNG VON METALLSUBSTRATEN

Title (fr)

TRAITEMENT DE SURFACE DE SUBSTRATS MÉTALLIQUES

Publication

EP 3198054 C0 20230607 (FR)

Application

EP 15770520 A 20150925

Priority

  • FR 1459158 A 20140926
  • EP 2015072172 W 20150925

Abstract (en)

[origin: WO2016046401A1] The present invention is directed mainly towards a process for the surface treatment of metal substrates, comprising the steps of: (i) providing a metal substrate comprising surface hydroxyl groups, (ii) bringing the metal substrate into contact with a solution of at least one organophosphorus compound so as to allow the reaction of said surface hydroxyl groups of the metal substrate with said organophosphorus compound in order to form a monomolecular layer on the surface and a second layer of at least predominantly crystalline physisorbed organophosphorus molecules, the treated substrate obtained being coated with organophosphorus compound in monomolecular form and in at least predominantly crystalline physisorbed form. It is also moreover directed towards a treated metal substrate that can be obtained by means of this process, the corresponding solution and the use thereof for the treatment of metal substrates for the purpose of improving the tribological properties thereof during the shaping thereof, in particular by stamping.

IPC 8 full level

C23C 22/06 (2006.01); C10M 137/12 (2006.01); C23C 22/03 (2006.01); C23F 11/167 (2006.01); C10N 30/06 (2006.01); C10N 30/12 (2006.01); C10N 40/20 (2006.01); C10N 40/24 (2006.01); C10N 50/00 (2006.01)

CPC (source: CN EP US)

C10M 105/74 (2013.01 - US); C10M 137/12 (2013.01 - EP US); C23C 22/03 (2013.01 - CN EP US); C23C 22/06 (2013.01 - CN EP US); C23C 22/07 (2013.01 - US); C23F 11/1676 (2013.01 - CN EP US); C10M 2223/06 (2013.01 - EP US); C10M 2223/0603 (2013.01 - US); C10N 2030/06 (2013.01 - EP US); C10N 2030/12 (2013.01 - EP US); C10N 2040/24 (2013.01 - EP US); C10N 2040/244 (2020.05 - EP US); C10N 2040/245 (2020.05 - EP US); C10N 2040/246 (2020.05 - EP US); C10N 2040/247 (2020.05 - EP US); C10N 2050/023 (2020.05 - EP US)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated validation state (EPC)

MA

Participating member state (EPC – UP)

AT BE BG DE DK EE FI FR IT LT LU LV MT NL PT SE SI

DOCDB simple family (publication)

WO 2016046401 A1 20160331; CA 2962057 A1 20160331; CA 2962057 C 20210420; CN 107109657 A 20170829; CN 107109657 B 20190830; EP 3198054 A1 20170802; EP 3198054 B1 20230607; EP 3198054 C0 20230607; ES 2952509 T3 20231031; FR 3026412 A1 20160401; FR 3026412 B1 20190329; MA 39690 A 20160331; PL 3198054 T3 20240108; US 10196744 B2 20190205; US 2018119287 A1 20180503

DOCDB simple family (application)

EP 2015072172 W 20150925; CA 2962057 A 20150925; CN 201580052122 A 20150925; EP 15770520 A 20150925; ES 15770520 T 20150925; FR 1459158 A 20140926; MA 39690 A 20150925; PL 15770520 T 20150925; US 201515514809 A 20150925