EP 3211053 A4 20170906 - COMPOSITION FOR POLISHING
Title (en)
COMPOSITION FOR POLISHING
Title (de)
ZUSAMMENSETZUNG ZUM POLIEREN
Title (fr)
COMPOSITION POUR POLISSAGE
Publication
Application
Priority
- JP 2014215744 A 20141022
- JP 2015005217 W 20151015
Abstract (en)
[origin: EP3211053A1] Provided is a polishing composition capable of keeping a good polishing removal rate stably. The polishing composition includes silica particles as abrasives and a basic compound as a polishing removal accelerator. The silica particles have a density of silanol groups that is 1.5 to 6.0 pieces/nm 2 . The polishing composition has an adsorption ratio parameter A that is 1.2 or less, the adsorption ratio parameter representing concentration dependency of an amount of adsorption of the basic compound to the silica particles as the ratio of high-concentration adsorption amount/low-concentration adsorption amount.
IPC 8 full level
C09G 1/02 (2006.01); B24B 37/00 (2012.01); C09K 3/14 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP KR US)
B24B 37/00 (2013.01 - US); C09G 1/02 (2013.01 - EP KR US); C09G 1/18 (2013.01 - US); C09K 3/14 (2013.01 - US); C09K 3/1409 (2013.01 - EP KR); C09K 3/1436 (2013.01 - US); C09K 3/1463 (2013.01 - US); H01L 21/02024 (2013.01 - EP KR); H01L 21/304 (2013.01 - KR US); H01L 21/321 (2013.01 - US); C09K 3/1463 (2013.01 - EP)
Citation (search report)
- [X] WO 2012099845 A2 20120726 - CABOT MICROELECTRONICS CORP [US]
- [X] FR 2879617 A1 20060623 - ROHM & HAAS ELECT MAT [US]
- [X] US 2005205837 A1 20050922 - MIWA TOSHIHIRO [JP]
- [X] EP 1403351 A1 20040331 - FUJIMI INC [JP]
- [X] US 2003064671 A1 20030403 - PASQUALONI ANTHONY MARK [US], et al
- [X] EP 1006166 A1 20000607 - FUJIMI INC [JP]
- See references of WO 2016063505A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3211053 A1 20170830; EP 3211053 A4 20170906; EP 3211053 B1 20181219; CN 107075347 A 20170818; CN 107075347 B 20200320; JP 2016084371 A 20160519; JP 6482234 B2 20190313; KR 102515964 B1 20230331; KR 20170074869 A 20170630; SG 11201702915Q A 20170530; TW 201629183 A 20160816; TW I718998 B 20210221; US 10190024 B2 20190129; US 2017247574 A1 20170831; WO 2016063505 A1 20160428
DOCDB simple family (application)
EP 15852540 A 20151015; CN 201580056621 A 20151015; JP 2014215744 A 20141022; JP 2015005217 W 20151015; KR 20177010175 A 20151015; SG 11201702915Q A 20151015; TW 104134557 A 20151021; US 201515519578 A 20151015