EP 3216483 A4 20180627 - NEEDLE ASSEMBLY FOR TRANSDERMAL ADMINISTRATION AND METHOD FOR MANUFACTURING SAME
Title (en)
NEEDLE ASSEMBLY FOR TRANSDERMAL ADMINISTRATION AND METHOD FOR MANUFACTURING SAME
Title (de)
NADELANORDNUNG ZUR TRANSDERMALEN VERABREICHUNG UND VERFAHREN ZUR HERSTELLUNG DAVON
Title (fr)
ENSEMBLE D'AIGUILLES POUR ADMINISTRATION TRANSDERMIQUE ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- JP 2014226794 A 20141107
- JP 2015080587 W 20151029
Abstract (en)
[origin: EP3216483A1] A needle assembly for transdermal administration includes a substrate having a first surface and a second surface opposite to the first surface, and a plurality of fine needles projecting perpendicularly from the first surface. The substrate includes a plurality of grooves formed in at least one of the first surface and the second surface. The plurality of grooves are formed to allow the substrate to deform following a surface shape of the skin of the body, such that axes of the fine needles are each displaced in a direction coinciding with a direction of the line normal to the surface of the skin of the body.
IPC 8 full level
A61M 37/00 (2006.01); B29C 33/38 (2006.01); B29C 43/02 (2006.01); B29L 31/00 (2006.01)
CPC (source: EP US)
A61M 37/0015 (2013.01 - EP US); B29C 43/021 (2013.01 - EP US); A61M 2037/0023 (2013.01 - EP US); A61M 2037/0053 (2013.01 - EP US); B29C 33/3857 (2013.01 - EP US); B29C 2043/022 (2013.01 - EP US); B29L 2031/7544 (2013.01 - EP US); B29L 2031/756 (2013.01 - EP US)
Citation (search report)
- [XA] US 2010274203 A1 20101028 - LEE SEUNG SEOB [KR], et al
- [XA] KR 20110092914 A 20110818 - MITI SYSTEMS INC [KR]
- [XI] EP 1377338 A2 20040107 - PROCTER & GAMBLE [US]
- See references of WO 2016072350A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3216483 A1 20170913; EP 3216483 A4 20180627; EP 3216483 B1 20190320; JP 6662296 B2 20200311; JP WO2016072350 A1 20170914; US 10799691 B2 20201013; US 2017232246 A1 20170817; WO 2016072350 A1 20160512
DOCDB simple family (application)
EP 15856973 A 20151029; JP 2015080587 W 20151029; JP 2016557736 A 20151029; US 201715586447 A 20170504