EP 3216888 A1 20170913 - STAINLESS STEEL MATERIAL FOR DIFFUSION BONDING
Title (en)
STAINLESS STEEL MATERIAL FOR DIFFUSION BONDING
Title (de)
EDELSTAHLMATERIAL ZUM DIFFUSIONSSCHWEISSEN
Title (fr)
MATÉRIAU EN ACIER INOXYDABLE DESTINÉ À LA LIAISON PAR DIFFUSION
Publication
Application
Priority
- JP 2014225576 A 20141105
- JP 2015079342 W 20151016
Abstract (en)
Provided is a stainless steel material suitable for diffusion bonded moldings in which diffusion bondability has been further improved without being affected by the extent of surface roughness. The present invention is a stainless steel material for diffusion bonding in which the metal structure before diffusion bonding has a multi-phase structure obtained from two or more of a ferrite phase, a martensite phase and an austenite phase, wherein: the mean crystal grain diameter in the multi-phase structure is not more than 20 µm; ³max represented by formula (a) is 10-90; and creep elongation when a 1.0 MPa load is applied at 1000°C for 0.5 h is at least 0.2%. ³max = 420 C ˆ’ 11.5 Si + 7 Mn + 23 Ni ˆ’ 11.5 Cr ˆ’ 12 Mo + 9 Cu ˆ’ 49 Ti ˆ’ 47 Nb ˆ’ 52 Al + 470 N + 189 The element notations in formula (a) represent the contents (mass%) of the respective elements.
IPC 8 full level
C22C 38/00 (2006.01); C22C 38/58 (2006.01)
CPC (source: EP KR US)
C22C 38/00 (2013.01 - EP US); C22C 38/001 (2013.01 - EP US); C22C 38/02 (2013.01 - EP US); C22C 38/06 (2013.01 - EP US); C22C 38/40 (2013.01 - KR); C22C 38/46 (2013.01 - KR); C22C 38/48 (2013.01 - KR); C22C 38/50 (2013.01 - EP KR US); C22C 38/54 (2013.01 - KR); C22C 38/58 (2013.01 - EP KR US); C21D 2211/001 (2013.01 - EP US); C21D 2211/005 (2013.01 - EP US); C21D 2211/008 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3216888 A1 20170913; EP 3216888 A4 20180530; EP 3216888 B1 20210602; CN 107002189 A 20170801; CN 107002189 B 20190705; ES 2886446 T3 20211220; JP 2016089223 A 20160523; JP 6129140 B2 20170517; KR 102384698 B1 20220407; KR 20170084138 A 20170719; SG 11201703499X A 20170629; TW 201625806 A 20160716; TW I680193 B 20191221; US 2017321311 A1 20171109; WO 2016072244 A1 20160512
DOCDB simple family (application)
EP 15857850 A 20151016; CN 201580056844 A 20151016; ES 15857850 T 20151016; JP 2014225576 A 20141105; JP 2015079342 W 20151016; KR 20177015017 A 20151016; SG 11201703499X A 20151016; TW 104136186 A 20151103; US 201515523882 A 20151016