EP 3234219 B1 20190327 - PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS DEPOSITION OF PALLADIUM
Title (en)
PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS DEPOSITION OF PALLADIUM
Title (de)
BADZUSAMMENSETZUNG UND VERFAHREN ZUR STROMLOSEN ABSCHEIDUNG VON PALLADIUM
Title (fr)
COMPOSITION DE BAIN DE PLACAGE ET PROCÉDÉ POUR DÉPÔT AUTOCATALYTIQUE DE PALLADIUM
Publication
Application
Priority
- EP 14198656 A 20141217
- EP 2015080138 W 20151217
Abstract (en)
[origin: WO2016097084A1] The present invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the present invention comprises a source for palladium ions, a reducing agent for palladium ions and an aldehyde compound. The aqueous plating bath composition has an increased deposition rate for palladium while maintaining bath stability. The aqueous plating bath composition has also a prolonged life time. The aldehyde compounds of the present invention allow for adjusting the deposition rate to a constant range over the bath life time and for electrolessly depositing palladium layers at lower temperatures. The aldehyde compounds of the present invention activate electroless palladium plating baths having a low deposition rate and reactivate aged electroless palladium plating baths.
IPC 8 full level
C23C 18/44 (2006.01)
CPC (source: CN EP KR US)
C23C 18/1617 (2013.01 - KR); C23C 18/1646 (2013.01 - US); C23C 18/1651 (2013.01 - KR); C23C 18/44 (2013.01 - CN EP KR US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2016097084 A1 20160623; CN 107109653 A 20170829; CN 107109653 B 20200207; EP 3234219 A1 20171025; EP 3234219 B1 20190327; JP 2017538867 A 20171228; JP 6664400 B2 20200313; KR 102459744 B1 20221026; KR 20170093845 A 20170816; MY 181601 A 20201229; TW 201627531 A 20160801; TW I680207 B 20191221; US 2017321327 A1 20171109
DOCDB simple family (application)
EP 2015080138 W 20151217; CN 201580068788 A 20151217; EP 15813382 A 20151217; JP 2017533002 A 20151217; KR 20177015896 A 20151217; MY PI2017701577 A 20151217; TW 104142555 A 20151217; US 201515522321 A 20151217