EP 3234969 A2 20171025 - METHOD FOR CHEMICAL BINDING OF THE DIELECTRIC TO THE ELECTRODE AFTER THEIR ASSEMBLY
Title (en)
METHOD FOR CHEMICAL BINDING OF THE DIELECTRIC TO THE ELECTRODE AFTER THEIR ASSEMBLY
Title (de)
VERFAHREN ZUR CHEMISCHEN BINDUNG DES DIELEKTRIKUMS AN DIE ELEKTRODE NACH IHRER MONTAGE
Title (fr)
MÉTHODE DE LIAISON CHIMIQUE DU DIÉLELECTRIQUE À L'ÉLECTRODE APRÈS LEUR ASSEMBLAGE
Publication
Application
Priority
- US 201414574175 A 20141217
- US 2015065677 W 20151215
Abstract (en)
[origin: WO2016100260A2] Embodiments of a high-permittivity, low-leakage energy storage device, such as a capacitor, and methods of making the energy storage device are disclosed. The disclosed device includes electrically conductive first and second electrodes, and a sterically constrained dielectric film disposed between the first and second electrodes. The sterically constrained dielectric film comprises a plurality of polymeric molecules, and at least some of the polymeric molecules are bound to the first electrode. The disclosed device may include an insulative layer between the first electrode and the dielectric film and/or between the second electrode and the dielectric film.
IPC 8 full level
H01G 4/14 (2006.01); H01G 4/18 (2006.01); H01G 4/30 (2006.01); H01G 4/32 (2006.01)
CPC (source: CN EP KR)
H01G 4/14 (2013.01 - CN EP KR); H01G 4/18 (2013.01 - CN EP KR); H01G 4/30 (2013.01 - CN); H01G 4/32 (2013.01 - CN); H01G 4/30 (2013.01 - EP KR); H01G 4/32 (2013.01 - EP KR)
Citation (search report)
See references of WO 2016100260A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2016100260 A2 20160623; WO 2016100260 A3 20170209; AU 2015362772 A1 20170615; AU 2015362772 B2 20201112; CN 107004505 A 20170801; CN 107004505 B 20200103; EP 3234969 A2 20171025; JP 2018503243 A 20180201; JP 6689851 B2 20200428; KR 102561229 B1 20230728; KR 20170095962 A 20170823; SG 11201704406W A 20170728; TW 201640536 A 20161116; TW I713060 B 20201211
DOCDB simple family (application)
US 2015065677 W 20151215; AU 2015362772 A 20151215; CN 201580069062 A 20151215; EP 15820006 A 20151215; JP 2017528416 A 20151215; KR 20177019338 A 20151215; SG 11201704406W A 20151215; TW 104142027 A 20151215