EP 3235354 A2 20171025 - CONTACTING EMBEDDED ELECTRONIC COMPONENT VIA WIRING STRUCTURE IN A COMPONENT CARRIER'S SURFACE PORTION WITH HOMOGENEOUS ABLATION PROPERTIES
Title (en)
CONTACTING EMBEDDED ELECTRONIC COMPONENT VIA WIRING STRUCTURE IN A COMPONENT CARRIER'S SURFACE PORTION WITH HOMOGENEOUS ABLATION PROPERTIES
Title (de)
KONTAKTIERUNG EINER EINGEBETTETEN ELEKTRONISCHEN KOMPONENTE ÜBER EINE VERDRAHTUNGSSTRUKTUR IN EINEM TEIL EINER KOMPONENTENTRÄGEROBERFLÄCHE MIT HOMOGENEN ABLATIONSEIGENSCHAFTEN
Title (fr)
MISE EN CONTACT DE COMPOSANT ÉLECTRONIQUE ENCASTRÉ PAR LE BIAIS D'UNE STRUCTURE DE CÂBLAGE DANS UNE PARTIE DE SURFACE D'UN SUPPORT DE COMPOSANTS PRÉSENTANT DES PROPRIÉTÉS D'ABLATION HOMOGÈNE
Publication
Application
Priority
- DE 102014118788 A 20141216
- EP 2015079933 W 20151216
Abstract (en)
[origin: WO2016096947A2] A component carrier (100) for carrying electronic components (104), wherein the component carrier (100) comprises an at least partially electrically insulating core (102), at least one electronic component (104) embedded in the core (102), and a coupling structure (106, 202) with at least one electrically conductive through-connection (108) extending at least partially therethrough and having a component contacting end (112) and a wiring contacting end (114), wherein the at least one electronic component (104) is electrically contacted directly to the component contacting end (112), wherein at least an exterior surface portion of the coupling structure (106, 202) has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure (110), and wherein the wiring contacting end (114) is electrically contacted directly to the wiring structure (110).
IPC 8 full level
H05K 1/18 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 23/538 (2006.01); H05K 3/04 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01); H05K 3/24 (2006.01)
CPC (source: CN EP US)
H01L 21/4803 (2013.01 - US); H01L 21/4846 (2013.01 - EP US); H01L 21/486 (2013.01 - US); H01L 23/13 (2013.01 - US); H01L 23/145 (2013.01 - US); H01L 23/3107 (2013.01 - EP US); H01L 23/3121 (2013.01 - US); H01L 23/49822 (2013.01 - US); H01L 23/49827 (2013.01 - US); H01L 23/49838 (2013.01 - US); H01L 23/5389 (2013.01 - CN EP US); H01L 24/08 (2013.01 - US); H01L 24/19 (2013.01 - EP); H01L 24/32 (2013.01 - US); H01L 24/82 (2013.01 - US); H05K 1/185 (2013.01 - CN EP US); H05K 3/0035 (2013.01 - EP US); H05K 3/107 (2013.01 - CN EP US); H01L 2224/04105 (2013.01 - EP); H01L 2224/08235 (2013.01 - US); H01L 2224/18 (2013.01 - EP); H01L 2224/214 (2013.01 - EP); H01L 2224/32225 (2013.01 - EP US); H01L 2224/73267 (2013.01 - EP US); H01L 2224/92244 (2013.01 - EP); H01L 2224/94 (2013.01 - EP); H01L 2924/15153 (2013.01 - EP); H05K 1/0366 (2013.01 - US); H05K 1/09 (2013.01 - US); H05K 1/115 (2013.01 - US); H05K 1/186 (2013.01 - US); H05K 3/0032 (2013.01 - US); H05K 3/027 (2013.01 - US); H05K 3/045 (2013.01 - EP US); H05K 3/181 (2013.01 - US); H05K 3/184 (2013.01 - EP US); H05K 3/188 (2013.01 - US); H05K 3/242 (2013.01 - EP US); H05K 2201/0236 (2013.01 - EP US); H05K 2201/0376 (2013.01 - EP US); H05K 2203/107 (2013.01 - US); H05K 2203/1469 (2013.01 - EP US)
C-Set (source: EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2016096947 A2 20160623; WO 2016096947 A3 20160915; CN 107223284 A 20170929; CN 107223284 B 20200424; CN 110880490 A 20200313; EP 3235354 A2 20171025; EP 3235354 B1 20240124; US 10424541 B2 20190924; US 10643949 B2 20200505; US 2017330837 A1 20171116; US 2019393155 A1 20191226
DOCDB simple family (application)
EP 2015079933 W 20151216; CN 201580076115 A 20151216; CN 201911047091 A 20151216; EP 15820078 A 20151216; US 201515536607 A 20151216; US 201916560188 A 20190904