Global Patent Index - EP 3237645 A1

EP 3237645 A1 20171101 - CORROSION AND MOISTURE RESISTANT COPPER BASED BONDING WIRE COMPRISING NICKEL

Title (en)

CORROSION AND MOISTURE RESISTANT COPPER BASED BONDING WIRE COMPRISING NICKEL

Title (de)

KORROSIONS- UND FEUCHTIGKEITSBESTÄNDIGER AUF BONDDRAHT AUF KUPFERBASIS MIT NICKEL

Title (fr)

FIL DE CONNEXION À BASE DE CUIVRE RÉSISTANT À L'HUMIDITÉ ET À LA CORROSION ET COMPRENANT DU NICKEL

Publication

EP 3237645 A1 20171101 (EN)

Application

EP 15818103 A 20151126

Priority

  • SG 10201408586X A 20141222
  • SG 2015000142 W 20151126

Abstract (en)

[origin: WO2016105276A1] A wire comprising a core comprising or consisting of (a) nickel in an amount in the range of from 0.005 to 5 wt.-%, (b) optionally, silver in an amount in the range of from 0.005 to 1 wt.-%, (c) copper in an amount in the range of from 94 wt.-% to 99.98 wt.-%, and (d) 0 to 100 wt.-ppm of further components, wherein all amounts in wt.-% and wt.-ppm are based on the total weight of the core, wherein the core has an average size of crystal grains in the range of from 1.5 to 30 μm, the average size determined according to the line intercept method, wherein the wire has an average diameter in the range of from 8 to 80 μm.

IPC 8 full level

C22C 9/00 (2006.01); B32B 15/01 (2006.01); C22C 9/06 (2006.01); C22F 1/08 (2006.01); C23C 28/00 (2006.01)

CPC (source: EP US)

B32B 15/01 (2013.01 - EP); B32B 15/018 (2013.01 - EP); C22C 1/02 (2013.01 - EP); C22C 1/03 (2013.01 - EP); C22C 9/00 (2013.01 - EP US); C22C 9/06 (2013.01 - EP); C22F 1/08 (2013.01 - EP); C23C 18/1651 (2013.01 - EP); C23C 18/1653 (2013.01 - EP); C23C 28/023 (2013.01 - EP); C23C 28/042 (2013.01 - EP); C25D 5/10 (2013.01 - EP US); C25D 7/0607 (2013.01 - EP); H01L 24/43 (2013.01 - EP); H01L 24/45 (2013.01 - EP); H01L 2224/43848 (2013.01 - EP); H01L 2224/45014 (2013.01 - EP); H01L 2224/45147 (2013.01 - EP); H01L 2224/45565 (2013.01 - EP); H01L 2224/45572 (2013.01 - EP); H01L 2224/45639 (2013.01 - EP); H01L 2224/45644 (2013.01 - EP); H01L 2224/45664 (2013.01 - EP); H01L 2224/45669 (2013.01 - EP); H01L 2924/00014 (2013.01 - EP)

C-Set (source: EP)

  1. H01L 2924/00014 + H01L 2224/45015 + H01L 2924/2075
  2. H01L 2924/00014 + H01L 2224/45014 + H01L 2924/206
  3. H01L 2224/45147 + H01L 2924/01028
  4. H01L 2224/45147 + H01L 2924/01047
  5. H01L 2224/45565 + H01L 2224/45147 + H01L 2224/45664
  6. H01L 2224/45565 + H01L 2224/45147 + H01L 2224/45669
  7. H01L 2224/45565 + H01L 2224/45147 + H01L 2224/45639
  8. H01L 2224/45572 + H01L 2224/45147 + H01L 2224/45664 + H01L 2224/45644
  9. H01L 2224/45572 + H01L 2224/45147 + H01L 2224/45669 + H01L 2224/45644
  10. H01L 2224/45572 + H01L 2224/45147 + H01L 2224/45639 + H01L 2224/45644
  11. H01L 2224/45147 + H01L 2924/01201
  12. H01L 2924/00014 + H01L 2224/45015 + H01L 2924/20751
  13. H01L 2224/45147 + H01L 2924/01202
  14. H01L 2224/45147 + H01L 2924/01203
  15. H01L 2924/00014 + H01L 2224/45015 + H01L 2924/20752
  16. H01L 2924/00014 + H01L 2224/45015 + H01L 2924/20753
  17. H01L 2924/00014 + H01L 2224/45015 + H01L 2924/20754
  18. H01L 2924/00014 + H01L 2224/45015 + H01L 2924/20755
  19. H01L 2924/00014 + H01L 2224/45015 + H01L 2924/20756
  20. H01L 2924/00014 + H01L 2224/45015 + H01L 2924/20757
  21. H01L 2924/00014 + H01L 2224/45015 + H01L 2924/20758

Citation (search report)

See references of WO 2016105276A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

WO 2016105276 A1 20160630; WO 2016105276 A8 20170629; CN 107109532 A 20170829; EP 3237645 A1 20171101; JP 2018503743 A 20180208; SG 10201408586X A 20160728; TW 201631602 A 20160901; TW I587317 B 20170611

DOCDB simple family (application)

SG 2015000142 W 20151126; CN 201580062949 A 20151126; EP 15818103 A 20151126; JP 2017532118 A 20151126; SG 10201408586X A 20141222; TW 104142565 A 20151217