Global Patent Index - EP 3248254 B1

EP 3248254 B1 20210106 - EMISSION TIP ASSEMBLY AND METHOD FOR OPERATING SAME

Title (en)

EMISSION TIP ASSEMBLY AND METHOD FOR OPERATING SAME

Title (de)

EMISSIONSSPITZEN-ANORDNUNG UND VERFAHREN ZUR DEREN BETRIEB

Title (fr)

AGENCEMENT DE POINTES D'ÉMISSION ET SON PROCÉDÉ DE FONCTIONNEMENT

Publication

EP 3248254 B1 20210106 (DE)

Application

EP 16701246 A 20160119

Priority

  • DE 102015000800 A 20150122
  • EP 2016000082 W 20160119

Abstract (en)

[origin: WO2016116269A1] The invention relates to an emission tip assembly (100) on high-voltage electrodes for charging or discharging substrates, comprising at least one emission tip (1) and a carrier body (7) composed of an insulating material, which has at least one high-resistance series resistor (13), wherein the at least one emission tip (1) can be connected to a high-voltage connection (14) by means of the series resistor (13). In order to have available an assembly of emission tips which, despite protrusion from the carrier body (7) thereof to any extent in principle and despite the metal profiled element (10, 10a) provided with the insulating potting mass (6), causes no injuries in the event of unintentional and intentional contact and thus permits safe handling together with high efficiency of the assembly, the emission tip (1) is formed of a spring metal and forms an elastic spring element, and a free end of the emission tip (1) is freely spaced apart from the carrier body (7), the particular metal profiled element (10, 10a), and the insulating potting mass (6), as a corona tip (2). In addition, the range effect of a discharge electrode is improved by the guiding of an auxiliary air quantity (15) directly to the corona tip (2).

IPC 8 full level

H01T 19/04 (2006.01); H01T 23/00 (2006.01)

CPC (source: EP US)

H01T 19/00 (2013.01 - US); H01T 19/04 (2013.01 - EP US); H01T 23/00 (2013.01 - EP US); H05F 3/00 (2013.01 - US); H05F 3/02 (2013.01 - US); H05F 3/04 (2013.01 - US); H05F 3/06 (2013.01 - US)

Citation (examination)

JP 2003284945 A 20031007 - SHARP KK

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

DE 102015000800 B3 20160630; EP 3248254 A1 20171129; EP 3248254 B1 20210106; US 10727651 B2 20200728; US 2017338630 A1 20171123; WO 2016116269 A1 20160728

DOCDB simple family (application)

DE 102015000800 A 20150122; EP 16701246 A 20160119; EP 2016000082 W 20160119; US 201615533826 A 20160119