EP 3250018 A4 20180117 - HEAD UNIT FOR COMPONENT MOUNTING DEVICE

Title (en)

HEAD UNIT FOR COMPONENT MOUNTING DEVICE

Title (de)

KOPFEINHEIT FÜR KOMPONENTENANBRINGUNGSVORRICHTUNG

Title (fr)

UNITÉ DE TÊTE POUR DISPOSITIF DE MONTAGE DE COMPOSANTS

Publication

EP 3250018 A4 20180117 (EN)

Application

EP 15878705 A 20150119

Priority

JP 2015051254 W 20150119

Abstract (en)

[origin: EP3250018A1] Head unit 34 is provided with rotary head 42, suction nozzle 48, linear motor actuator 62, outer cover 40, and heat pipe 70. Suction nozzle 48 is attached to an end of nozzle holder 46 so as to be slidable in a vertical direction. Linear motor actuator 62 engages and pushes down nozzle operation lever 54 of nozzle holder 46 using nozzle engaging section 66 attached to slider 64, and releases the engagement. Outer cover 40 covers linear motor actuator 62. Heat pipe 70 connects outer cover 40 and sub frame 38 that surrounds linear motor actuator 62 such that heat generated by linear motor actuator escapes to outer cover 40. By this, heat inside outer cover 40 is released efficiently.

IPC 8 full level

H05K 13/04 (2006.01); H02K 9/00 (2006.01)

CPC (source: EP US)

H02K 41/033 (2013.01 - US); H05K 1/0203 (2013.01 - US); H05K 13/0406 (2018.07 - EP US); F28D 1/024 (2013.01 - US); H01L 23/427 (2013.01 - US)

Citation (search report)

[YA] DE 102006017033 A1 20071025 - SIEMENS AG [DE]
[YA] EP 2755308 A1 20140716 - THK CO LTD [JP]
[YA] WO 2010036204 A1 20100401 - GOH CHAI MENG [SG], et al
[YA] EP 1246520 A2 20021002 - SANYO ELECTRIC CO [JP], et al
[YA] JP 2010045143 A 20100225 - HITACHI HIGH TECH INSTR CO LTD
[YA] JP 2010172071 A 20100805 - FUJI MACHINE MFG
See references of WO 2016117009A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 3250018 A1 20171129; EP 3250018 A4 20180117; EP 3250018 B1 20190814; CN 107114011 A 20170829; CN 107114011 B 20200414; JP 6570550 B2 20190904; JP WO2016117009 A1 20171026; US 10709047 B2 20200707; US 2018006543 A1 20180104; WO 2016117009 A1 20160728

DOCDB simple family (application)

EP 15878705 A 20150119; CN 201580073461 A 20150119; JP 2015051254 W 20150119; JP 2016570226 A 20150119; US 201515542798 A 20150119