EP 3254020 B1 20180606 - LED MODULE AND METHOD OF SEALING
Title (en)
LED MODULE AND METHOD OF SEALING
Title (de)
LED-MODUL UND ABDICHTVERFAHREN
Title (fr)
MODULE DEL ET MÉTHODE D'ÉTANCHER
Publication
Application
Priority
- EP 15153981 A 20150205
- EP 2016051413 W 20160125
Abstract (en)
[origin: WO2016124429A1] This invention relates to the field of lighting modules employing light emitting diodes (LEDs), and more particularly to LED modules suitable for exposed lens plate luminaires. There is herein provided an LED module having a printed circuit board comprising at least two layers, wherein the interface between two layers at a side surface of the printed circuit board is covered by a protrusion of an optically transmissive cover plate. The same said optically transmissive cover plate is also adapted to cover at least one LED positioned in or on the printed circuit board.
IPC 8 full level
F21V 3/02 (2006.01); F21K 99/00 (2016.01); F21V 31/00 (2006.01); F21Y 115/10 (2016.01)
CPC (source: CN EP RU US)
F21K 9/90 (2013.01 - CN EP US); F21V 3/02 (2013.01 - CN EP RU US); F21V 17/06 (2013.01 - US); F21V 17/101 (2013.01 - US); F21V 19/0015 (2013.01 - US); F21V 31/005 (2013.01 - CN EP US); H05K 1/056 (2013.01 - EP US); H05K 3/284 (2013.01 - US); F21Y 2115/10 (2016.08 - CN EP US); H05K 1/181 (2013.01 - US); H05K 3/28 (2013.01 - EP US); H05K 3/303 (2013.01 - US); H05K 2201/09154 (2013.01 - EP US); H05K 2201/10106 (2013.01 - EP US); H05K 2201/10522 (2013.01 - US); H05K 2203/1147 (2013.01 - EP US); H05K 2203/1316 (2013.01 - US); H05K 2203/1327 (2013.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2016124429 A1 20160811; CN 107208874 A 20170926; CN 107208874 B 20200218; EP 3254020 A1 20171213; EP 3254020 B1 20180606; JP 2018508948 A 20180329; JP 6290518 B1 20180307; RU 2017131061 A 20190305; RU 2017131061 A3 20190528; RU 2695700 C2 20190725; US 10352551 B2 20190716; US 2018017247 A1 20180118
DOCDB simple family (application)
EP 2016051413 W 20160125; CN 201680008895 A 20160125; EP 16701480 A 20160125; JP 2017540884 A 20160125; RU 2017131061 A 20160125; US 201615548025 A 20160125