EP 3257335 A1 20171220 - METHOD FOR PRODUCING A PLATED-THROUGH HOLE IN A MULTILAYER PRINTED CIRCUIT BOARD
Title (en)
METHOD FOR PRODUCING A PLATED-THROUGH HOLE IN A MULTILAYER PRINTED CIRCUIT BOARD
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER DURCHKONTAKTIERUNG BEI EINER MEHRLAGEN-LEITERPLATTE
Title (fr)
PROCÉDÉ DE FABRICATION D'UN CONTACT TRAVERSANT DANS UNE CARTE DE CIRCUIT IMPRIMÉ MULTICOUCHE
Publication
Application
Priority
- DE 102015001652 A 20150212
- EP 2016000210 W 20160206
Abstract (en)
[origin: WO2016128127A1] Method for producing a plated-through hole between conductor tracks which are arranged at the top and at the bottom in a multilayer printed circuit board which is composed of a printed circuit board material and comprises at least one copper profile which is embedded in the composite of the multilayer printed circuit board, wherein the plated-through hole is produced by the following method steps: producing a first bore with a first bore diameter through the multilayer printed circuit board by drilling through the top and the bottom conductor track and the embedded copper profile; filling the first bore with an insulating filling material; producing a second bore coaxially in relation to the first bore with a second, smaller bore diameter than the bore diameter of the first bore; lining the bore wall of the second bore with an electrically conductive material and in this way making electrical contact with the top and bottom conductor tracks.
IPC 8 full level
H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01)
CPC (source: EP)
H05K 1/0204 (2013.01); H05K 3/429 (2013.01); H05K 1/0207 (2013.01); H05K 3/4046 (2013.01); H05K 2201/09581 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/09809 (2013.01); H05K 2201/10416 (2013.01)
Citation (search report)
See references of WO 2016128127A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2016128127 A1 20160818; DE 102015001652 A1 20160818; EP 3257335 A1 20171220
DOCDB simple family (application)
EP 2016000210 W 20160206; DE 102015001652 A 20150212; EP 16706131 A 20160206