EP 3257337 A1 20171220 - ELECTRONIC ASSEMBLY AND METHOD FOR THE PRODUCTION THEREOF
Title (en)
ELECTRONIC ASSEMBLY AND METHOD FOR THE PRODUCTION THEREOF
Title (de)
ELEKTRONISCHE KOMPONENTE UND VERFAHREN ZU DEREN HERSTELLUNG
Title (fr)
COMPOSANT ÉLECTRONIQUE ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- DE 102015202298 A 20150210
- DE 102015208529 A 20150507
- EP 2016052094 W 20160201
Abstract (en)
[origin: WO2016128244A1] The invention relates to an electronic assembly (E) comprising: a carrier element (1), a circuit carrier (3) having a number of electronic components (4), a circuit board (6), which is electrically conductively connected to the circuit carrier (3), and a covering element (2) for covering the circuit carrier (3), the covering element (2) being arranged on one flat side of the circuit board (6) and the carrier element (1) being arranged on an opposite flat side of the circuit board (6). According to the invention, the circuit board (6) is welded respectively to the carrier element (1) and to the covering element (2). The invention further relates to a method for producing such an electronic assembly (E).
IPC 8 full level
H05K 1/14 (2006.01); H01L 23/053 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 5/00 (2006.01); H05K 5/06 (2006.01)
CPC (source: CN EP US)
H01L 23/053 (2013.01 - EP US); H05K 1/0204 (2013.01 - US); H05K 1/0271 (2013.01 - US); H05K 1/142 (2013.01 - CN EP US); H05K 1/144 (2013.01 - US); H05K 1/181 (2013.01 - EP US); H05K 3/284 (2013.01 - US); H05K 3/366 (2013.01 - US); H05K 3/368 (2013.01 - US); H05K 5/0082 (2013.01 - CN EP US); H05K 5/066 (2013.01 - CN); H01L 2224/48091 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H05K 1/0203 (2013.01 - CN EP US); H05K 1/181 (2013.01 - CN); H05K 3/0061 (2013.01 - CN EP US); H05K 2201/0129 (2013.01 - US); H05K 2201/041 (2013.01 - US); H05K 2201/10287 (2013.01 - US); H05K 2201/10522 (2013.01 - US); H05K 2203/049 (2013.01 - CN EP US); H05K 2203/107 (2013.01 - US); H05K 2203/1316 (2013.01 - US); H05K 2203/1327 (2013.01 - US); Y02P 70/50 (2015.11 - EP US)
C-Set (source: EP US)
Citation (search report)
See references of WO 2016128244A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102015208529 B3 20160804; CN 107211531 A 20170926; EP 3257337 A1 20171220; JP 2018512724 A 20180517; US 2017354036 A1 20171207; WO 2016128244 A1 20160818
DOCDB simple family (application)
DE 102015208529 A 20150507; CN 201680003786 A 20160201; EP 16702538 A 20160201; EP 2016052094 W 20160201; JP 2017541956 A 20160201; US 201715674137 A 20170810