Global Patent Index - EP 3260500 A1

EP 3260500 A1 20171227 - POLYAMIDE RESIN COMPOSITION, METHOD FOR PRODUCING POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE

Title (en)

POLYAMIDE RESIN COMPOSITION, METHOD FOR PRODUCING POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE

Title (de)

POLYAMIDHARZZUSAMMENSETZUNG, VERFAHREN ZUR HERSTELLUNG DER POLYAMIDHARZZUSAMMENSETZUNG UND FORMARTIKEL

Title (fr)

COMPOSITION DE RÉSINE DE POLYAMIDE, PROCÉDÉ POUR LA PRODUCTION D'UNE COMPOSITION DE RÉSINE DE POLYAMIDE ET OBJET MOULÉ

Publication

EP 3260500 A1 20171227 (EN)

Application

EP 16752218 A 20160126

Priority

  • JP 2015032126 A 20150220
  • JP 2016052197 W 20160126

Abstract (en)

The present invention provides a polyamide resin composition comprising (A) a polyamide resin, (B) an alkali metal compound and/or an alkaline earth metal compound, and (C) one or more compounds selected from following (C1) to (C4): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of periodic table, (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and (C4) an acid, wherein the content of the component (B) is 0.03 to 20 parts by mass based on 100 parts by mass in total of the component (A) and the component (C3), and the components (C1) to (C3) have following respective contents when selected: component (C1): 0.001 to 0.05 part by mass in terms of the amount of the metal element, component (C2): 0.8 to 20 parts by mass, and component (C3): 1 to 50 parts by mass.

IPC 8 full level

C08L 77/00 (2006.01); C08K 3/20 (2006.01); C08K 5/13 (2006.01); C08K 5/17 (2006.01); C08K 5/49 (2006.01); C08L 101/00 (2006.01)

CPC (source: EP US)

C08K 3/105 (2017.12 - US); C08K 3/20 (2013.01 - US); C08K 3/22 (2013.01 - EP US); C08K 3/26 (2013.01 - EP US); C08K 5/13 (2013.01 - EP US); C08K 5/132 (2013.01 - US); C08K 5/17 (2013.01 - EP US); C08K 5/49 (2013.01 - EP US); C08K 7/14 (2013.01 - EP US); C08L 77/00 (2013.01 - EP US); C08L 101/00 (2013.01 - EP US)

C-Set (source: EP US)

  1. C08K 3/22 + C08L 77/00
  2. C08K 3/26 + C08L 77/00
  3. C08K 7/14 + C08L 77/00
  4. C08K 5/13 + C08L 77/00
  5. C08K 5/17 + C08L 77/00
  6. C08K 5/49 + C08L 77/00

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 3260500 A1 20171227; EP 3260500 A4 20180131; EP 3260500 B1 20231108; CN 107250274 A 20171013; CN 107250274 B 20210202; JP 2019002025 A 20190110; JP 6457062 B2 20190123; JP 6762999 B2 20200930; JP WO2016132829 A1 20170907; US 10927232 B2 20210223; US 2018030236 A1 20180201; WO 2016132829 A1 20160825

DOCDB simple family (application)

EP 16752218 A 20160126; CN 201680010812 A 20160126; JP 2016052197 W 20160126; JP 2017500571 A 20160126; JP 2018169037 A 20180910; US 201615551716 A 20160126