EP 3262755 A1 20180103 - MEMS COMPONENT HAVING A HIGH INTEGRATION DENSITY
Title (en)
MEMS COMPONENT HAVING A HIGH INTEGRATION DENSITY
Title (de)
MEMS-BAUELEMENT MIT HOHER INTEGRATIONSDICHTE
Title (fr)
COMPOSANT MEMS À HAUTE DENSITÉ D'INTÉGRATION
Publication
Application
Priority
- DE 102015102869 A 20150227
- EP 2015080544 W 20151218
Abstract (en)
[origin: WO2016134803A1] The invention relates to a MEMS component having an increased integration density, and to a method for producing such a component. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between said base wafer and cover wafer. A second cavity is arranged over said cover wafer and beneath a thin-film cover. Said cavities contain component structures.
IPC 8 full level
B81B 7/02 (2006.01); B81C 1/00 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01)
CPC (source: CN EP US)
B81B 7/02 (2013.01 - CN EP US); H03H 9/0547 (2013.01 - CN EP US); H03H 9/105 (2013.01 - EP); H10N 30/02 (2023.02 - US); H10N 30/10513 (2023.02 - US); H10N 30/87 (2023.02 - US); H10N 30/88 (2023.02 - US); H10N 30/883 (2023.02 - US); B81B 2207/012 (2013.01 - CN EP US); B81B 2207/095 (2013.01 - CN EP US); B81C 2203/0118 (2013.01 - CN EP US); B81C 2203/0136 (2013.01 - CN EP US); B81C 2203/0145 (2013.01 - CN EP US); B81C 2203/0154 (2013.01 - CN EP US); H01L 2221/00 (2013.01 - US); H01L 2224/11 (2013.01 - EP US)
Citation (search report)
See references of WO 2016134803A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102015102869 A1 20160901; DE 102015102869 B4 20170511; CN 107207245 A 20170926; CN 107207245 B 20200214; EP 3262755 A1 20180103; JP 2018509305 A 20180405; JP 6873908 B2 20210519; US 10680159 B2 20200609; US 2018013055 A1 20180111; WO 2016134803 A1 20160901
DOCDB simple family (application)
DE 102015102869 A 20150227; CN 201580075070 A 20151218; EP 15813073 A 20151218; EP 2015080544 W 20151218; JP 2017545341 A 20151218; US 201515546229 A 20151218