Global Patent Index - EP 3262755 A1

EP 3262755 A1 20180103 - MEMS COMPONENT HAVING A HIGH INTEGRATION DENSITY

Title (en)

MEMS COMPONENT HAVING A HIGH INTEGRATION DENSITY

Title (de)

MEMS-BAUELEMENT MIT HOHER INTEGRATIONSDICHTE

Title (fr)

COMPOSANT MEMS À HAUTE DENSITÉ D'INTÉGRATION

Publication

EP 3262755 A1 20180103 (DE)

Application

EP 15813073 A 20151218

Priority

  • DE 102015102869 A 20150227
  • EP 2015080544 W 20151218

Abstract (en)

[origin: WO2016134803A1] The invention relates to a MEMS component having an increased integration density, and to a method for producing such a component. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between said base wafer and cover wafer. A second cavity is arranged over said cover wafer and beneath a thin-film cover. Said cavities contain component structures.

IPC 8 full level

H03H 9/05 (2006.01); B81B 7/02 (2006.01); B81C 1/00 (2006.01); H03H 9/10 (2006.01)

CPC (source: CN EP US)

B81B 7/02 (2013.01 - CN EP); H01L 41/047 (2013.01 - US); H01L 41/053 (2013.01 - US); H01L 41/0533 (2013.01 - US); H01L 41/081 (2013.01 - US); H01L 41/23 (2013.01 - US); H03H 9/0547 (2013.01 - CN EP); B81B 2207/012 (2013.01 - CN EP); B81B 2207/095 (2013.01 - CN EP); B81C 2203/0118 (2013.01 - CN EP); B81C 2203/0136 (2013.01 - CN EP); B81C 2203/0145 (2013.01 - CN EP); B81C 2203/0154 (2013.01 - CN EP); H01L 2221/00 (2013.01 - US); H01L 2224/11 (2013.01 - EP)

Citation (search report)

See references of WO 2016134803A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

DE 102015102869 A1 20160901; DE 102015102869 B4 20170511; CN 107207245 A 20170926; CN 107207245 B 20200214; EP 3262755 A1 20180103; JP 2018509305 A 20180405; US 10680159 B2 20200609; US 2018013055 A1 20180111; WO 2016134803 A1 20160901

DOCDB simple family (application)

DE 102015102869 A 20150227; CN 201580075070 A 20151218; EP 15813073 A 20151218; EP 2015080544 W 20151218; JP 2017545341 A 20151218; US 201515546229 A 20151218