EP 3264459 A1 20180103 - SHIELDED PACKAGE WITH INTEGRATED ANTENNA
Title (en)
SHIELDED PACKAGE WITH INTEGRATED ANTENNA
Title (de)
ABGESCHIRMTES PAKET MIT INTEGRIERTER ANTENNE
Title (fr)
BOÎTIER BLINDÉ AVEC ANTENNE INTÉGRÉE
Publication
Application
Priority
US 201615199838 A 20160630
Abstract (en)
A semiconductor structure includes a packaged semiconductor device (100) having at least one device (106,110,104,108), a conductive pillar (112), an encapsulant (202) over the at least one device and surrounding the conductive pillar, wherein the conductive pillar extends from a first major surface to a second major surface of the encapsulant, and is exposed at the second major surface and the at least one device is exposed at the first major surface. The packaged device also includes a conductive shield layer (802) on the second major surface of the encapsulant and on minor surfaces of the encapsulant and an isolation region (604) at the second major surface of the encapsulant between the encapsulant and the conductive pillar such that the conductive shield layer is electrically isolated from the conductive pillar. The semiconductor structure also includes a radio-frequency connection structure (1002) over and in electrical contact with the conductive pillar at the second major surface of the encapsulant.
IPC 8 full level
H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 21/56 (2006.01)
CPC (source: EP US)
H01L 21/485 (2013.01 - US); H01L 21/4853 (2013.01 - US); H01L 21/4867 (2013.01 - US); H01L 21/56 (2013.01 - US); H01L 21/78 (2013.01 - US); H01L 23/3114 (2013.01 - US); H01L 23/49838 (2013.01 - US); H01L 23/552 (2013.01 - EP US); H01L 23/66 (2013.01 - EP US); H01L 24/96 (2013.01 - EP US); H01L 24/97 (2013.01 - EP US); H01L 21/568 (2013.01 - EP US); H01L 2223/6677 (2013.01 - EP US); H01L 2224/04105 (2013.01 - EP US); H01L 2224/12105 (2013.01 - EP US); H01L 2224/24137 (2013.01 - EP US); H01L 2224/24195 (2013.01 - EP US); H01L 2924/141 (2013.01 - EP US); H01L 2924/143 (2013.01 - EP US); H01L 2924/1434 (2013.01 - EP US); H01L 2924/19041 (2013.01 - EP US); H01L 2924/19042 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US); H01L 2924/19105 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US)
Citation (search report)
- [XA] US 2013292808 A1 20131107 - YEN HAN-CHEE [TW], et al
- [XA] US 2012320558 A1 20121220 - FOSTER JAMES H [US], et al
- [A] US 8779564 B1 20140715 - KNUDSEN MIKAEL [DK], et al
- [A] US 2015194388 A1 20150709 - PABST EDUARD J [US], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3264459 A1 20180103; CN 107564891 A 20180109; CN 107564891 B 20240105; US 10236260 B2 20190319; US 10529670 B2 20200107; US 2018005957 A1 20180104; US 2019157216 A1 20190523
DOCDB simple family (application)
EP 17160175 A 20170309; CN 201710511397 A 20170628; US 201615199838 A 20160630; US 201916259396 A 20190128