Global Patent Index - EP 3272534 A1

EP 3272534 A1 20180124 - DIE ASSEMBLY AND LOCATING METHOD

Title (en)

DIE ASSEMBLY AND LOCATING METHOD

Title (de)

STEMPELANORDNUNG UND ORTUNGSVERFAHREN

Title (fr)

ENSEMBLE DE MATRICE ET PROCÉDÉ DE LOCALISATION

Publication

EP 3272534 A1 20180124 (EN)

Application

EP 17182687 A 20170721

Priority

GB 201612761 A 20160722

Abstract (en)

The invention provides a reusable assembly adapted for use in one or more of foiling, embossing and debossing. The assembly comprises a chase (104), having a first surface (114) with a plurality of user identifiable discrete grid positions (116) arranged within a grid and adapted for connection to a press. It further comprises a die assembly comprising a die (110) defining a first surface for foiling, embossing or debossing and connected to a linkage (106) defining a second surface (134) adapted for separable engagement with the first surface of the chase at various grid positions. A method of repositioning a die is also provided.

IPC 8 full level

B41F 1/38 (2006.01); B30B 15/02 (2006.01); B41F 1/56 (2006.01)

CPC (source: EP)

B30B 15/026 (2013.01); B41F 1/38 (2013.01); B41F 1/56 (2013.01)

Citation (applicant)

None

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 3272534 A1 20180124; EP 3272534 B1 20200108; GB 201612761 D0 20160907

DOCDB simple family (application)

EP 17182687 A 20170721; GB 201612761 A 20160722