EP 3272909 A1 20180124 - INDIUM ELECTROPLATING COMPOSITIONS AND METHODS FOR ELECTROPLATING INDIUM
Title (en)
INDIUM ELECTROPLATING COMPOSITIONS AND METHODS FOR ELECTROPLATING INDIUM
Title (de)
INDIUM-ELEKTROPLATTIERUNGSZUSAMMENSETZUNGEN UND INDIUM-ELEKTROPLATTIERUNGSVERFAHREN
Title (fr)
COMPOSITIONS ET PROCÉDÉS D'ÉLECTRODÉPOSITION D'INDIUM
Publication
Application
Priority
US 201615212713 A 20160718
Abstract (en)
Indium electroplating compositions electroplate substantially defect-free uniform layers which have a smooth surface morphology on metal layers. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials.
IPC 8 full level
C25D 3/54 (2006.01)
CPC (source: EP KR US)
C25D 3/54 (2013.01 - EP KR US); C25D 7/123 (2013.01 - KR); C25D 5/611 (2020.08 - KR)
Citation (search report)
- [XAYI] US 2008173550 A1 20080724 - KISO MASAYUKI [JP], et al
- [XAI] EP 1978051 A1 20081008 - ROHM & HAAS ELECT MAT [US]
- [X] US 2012055612 A1 20120308 - AHMED SHAFAAT [US], et al
- [X] EP 1544164 A2 20050622 - DALSA SEMICONDUCTOR INC [CA]
- [IY] SU 222104 A1 19691007
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3272909 A1 20180124; EP 3272909 B1 20190403; CN 107630238 A 20180126; CN 107630238 B 20190827; JP 2018012886 A 20180125; JP 6442001 B2 20181219; KR 102022926 B1 20190919; KR 20180009310 A 20180126; TW 201804023 A 20180201; TW I639735 B 20181101; US 2018016689 A1 20180118
DOCDB simple family (application)
EP 17181550 A 20170714; CN 201710512994 A 20170629; JP 2017123892 A 20170626; KR 20170084616 A 20170704; TW 106120952 A 20170622; US 201615212713 A 20160718