EP 3272911 B1 20190828 - INDIUM ELECTROPLATING COMPOSITIONS CONTAINING 2-IMIDAZOLIDINETHIONE COMPOUNDS AND METHODS FOR ELECTROPLATING INDIUM
Title (en)
INDIUM ELECTROPLATING COMPOSITIONS CONTAINING 2-IMIDAZOLIDINETHIONE COMPOUNDS AND METHODS FOR ELECTROPLATING INDIUM
Title (de)
INDIUM-ELEKTROPLATTIERUNGSZUSAMMENSETZUNGEN MIT 2-IMIDAZOLIDINETHION-VERBINDUNGEN UND INDIUM-ELEKTROPLATTIERUNGSVERFAHREN
Title (fr)
COMPOSITIONS D'ÉLECTRODÉPOSITION D'INDIUM CONTENANT DES COMPOSÉS DE 2-IMIDAZOLIDINETHIONE ET PROCÉDÉS D'ÉLECTRODÉPOSITION D'INDIUM
Publication
Application
Priority
US 201662363540 P 20160718
Abstract (en)
[origin: EP3272911A1] Indium electroplating compositions containing 2-imidazolidinethione compounds electroplate substantially defect-free uniform layers which have a smooth surface morphology on metal layers. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials.
IPC 8 full level
C25D 3/54 (2006.01)
CPC (source: EP KR US)
C25D 3/54 (2013.01 - EP KR US); C25D 7/12 (2013.01 - KR); C25D 7/123 (2013.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3272911 A1 20180124; EP 3272911 B1 20190828; CN 107630236 A 20180126; JP 2018012889 A 20180125; JP 6427632 B2 20181121; KR 102009176 B1 20190809; KR 20180009308 A 20180126; TW 201804024 A 20180201; TW I638913 B 20181021; US 2018016690 A1 20180118
DOCDB simple family (application)
EP 17181754 A 20170717; CN 201710496974 A 20170626; JP 2017128737 A 20170630; KR 20170082235 A 20170629; TW 106120953 A 20170622; US 201715593456 A 20170512