EP 3278351 A1 20180207 - PLASMA-TREATMENT DEVICE FOR WAFERS
Title (en)
PLASMA-TREATMENT DEVICE FOR WAFERS
Title (de)
PLASMA-BEHANDLUNGSVORRICHTUNG FÜR WAFER
Title (fr)
DISPOSITIF DE TRAITEMENT PAR PLASMA DE PLAQUETTES
Publication
Application
Priority
- DE 102015004414 A 20150402
- EP 2016057285 W 20160401
Abstract (en)
[origin: WO2016156606A1] The problem addressed by the inventions is that of providing an improved introduction of high-frequency waves into a wafer boat. This problem is solved in that a plasma-treatment device, in particular for semiconductor wafers for semiconductor or photovoltaic applications, is provided, comprising a processing chamber for receiving a wafer boat having a plurality of electrically conductive receiving elements for the wafers, means for controlling or regulating a process gas atmosphere in the processing chamber, and at least one voltage source, which can be connected to the wafer boat via a line guided into the processing chamber. The line is configured as a coaxial line having an inner conductor and an outer conductor, and between the inner conductor and the outer conductor, a dielectric is provided such that when impinged upon with high-frequency voltage, the propagation velocity and the wavelength of the electromagnetic wave in the coaxial conductor are reduced with respect to a corresponding propagation velocity and wavelength of the electromagnetic wave in vacuo.
IPC 8 full level
H01J 37/32 (2006.01)
CPC (source: EP US)
C23C 16/509 (2013.01 - US); H01J 37/32082 (2013.01 - EP US); H01J 37/32577 (2013.01 - EP US); H01J 37/32715 (2013.01 - EP US); H01L 21/67313 (2013.01 - US); H01L 21/67326 (2013.01 - US)
Citation (search report)
See references of WO 2016156606A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102015004414 A1 20161006; CN 108140528 A 20180608; CN 108140528 B 20191115; EP 3278351 A1 20180207; TW 201703109 A 20170116; US 2018076070 A1 20180315; WO 2016156606 A1 20161006
DOCDB simple family (application)
DE 102015004414 A 20150402; CN 201680032105 A 20160401; EP 16717581 A 20160401; EP 2016057285 W 20160401; TW 105110497 A 20160401; US 201615563647 A 20160401