EP 3280229 A4 20181031 - SUBSTRATE PROVIDED WITH TRANSPARENT CONDUCTIVE FILM
Title (en)
SUBSTRATE PROVIDED WITH TRANSPARENT CONDUCTIVE FILM
Title (de)
SUBSTRAT MIT TRANSPARENTEM LEITFÄHIGEM FILM
Title (fr)
SUBSTRAT POURVU D'UN FILM CONDUCTEUR TRANSPARENT
Publication
Application
Priority
- JP 2015071470 A 20150331
- JP 2016050754 W 20160113
Abstract (en)
[origin: US2018007786A1] Provided is a transparent conductive film-equipped substrate that makes it difficult for an insulating film provided on a portion from which a transparent conductive film has been removed to peel off. The transparent conductive film-equipped substrate 10 includes a substrate 1 and a transparent conductive film 2 provided on the substrate 1 and subjected to patterning, wherein the transparent conductive film-equipped substrate is made up so that: a removal region A1 where the transparent conductive film 2 has been removed by patterning, a non-removal region A2 where the transparent conductive film is left unremoved, and a boundary region A3 provided between the removal region A1 and the non-removal region A2 are formed on the substrate 1; and the boundary region A3 is formed with insular portions 2b in which the transparent conductive film 2 is formed in insular shapes.
IPC 8 full level
H05B 33/28 (2006.01); C03C 17/23 (2006.01); G02F 1/1343 (2006.01); H01B 5/14 (2006.01); H01B 13/00 (2006.01); H01L 51/50 (2006.01); H05B 33/02 (2006.01); H05B 33/04 (2006.01); H05K 3/02 (2006.01); H05K 3/08 (2006.01)
CPC (source: EP KR US)
C03C 17/23 (2013.01 - EP US); G02F 1/13439 (2013.01 - US); H05B 33/28 (2013.01 - EP US); H05K 1/0296 (2013.01 - US); H05K 1/0306 (2013.01 - US); H05K 3/027 (2013.01 - EP US); H10K 50/00 (2023.02 - US); H10K 71/421 (2023.02 - KR); H10K 71/621 (2023.02 - EP US); H10K 77/10 (2023.02 - KR); C03C 2217/94 (2013.01 - EP US); C03C 2217/948 (2013.01 - EP US); C03C 2218/328 (2013.01 - EP US); H05K 2201/0326 (2013.01 - EP US); H10K 50/81 (2023.02 - EP KR US); H10K 50/828 (2023.02 - US); H10K 50/85 (2023.02 - EP KR); H10K 2102/103 (2023.02 - EP US); Y02E 10/549 (2013.01 - EP)
Citation (search report)
- [XI] US 6149988 A 20001121 - SHINOHARA HISATO [JP], et al
- [XI] US 2008029152 A1 20080207 - MILSHTEIN EREL [US], et al
- [A] US 2004194302 A1 20041007 - BHULLAR RAGHBIR S [US], et al
- See also references of WO 2016157930A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
US 10187980 B2 20190122; US 2018007786 A1 20180104; CN 107211506 A 20170926; CN 107211506 B 20190514; EP 3280229 A1 20180207; EP 3280229 A4 20181031; JP 2016190392 A 20161110; JP 6519277 B2 20190529; KR 102381105 B1 20220330; KR 20170133313 A 20171205; TW 201635875 A 20161001; TW I687141 B 20200301; WO 2016157930 A1 20161006
DOCDB simple family (application)
US 201615539722 A 20160113; CN 201680004942 A 20160113; EP 16771816 A 20160113; JP 2015071470 A 20150331; JP 2016050754 W 20160113; KR 20177016908 A 20160113; TW 105102551 A 20160127