EP 3285136 A1 20180221 - FINGERPRINT CHIP PACKAGE STRUCTURE, INPUT ASSEMBLY AND TERMINAL
Title (en)
FINGERPRINT CHIP PACKAGE STRUCTURE, INPUT ASSEMBLY AND TERMINAL
Title (de)
FINGERABDRUCK-CHIP-PAKETSTRUKTUR, EINGABEANORDNUNG UND ENDGERÄT
Title (fr)
STRUCTURE DE BOÎTIER DE PUCE D'EMPREINTES DIGITALES, ENSEMBLE D'ENTRÉE ET TERMINAL
Publication
Application
Priority
- CN 201610675148 A 20160816
- CN 201620889023 U 20160816
Abstract (en)
The present disclosure provides a fingerprint chip package structure, an input assembly and a terminal. The fingerprint chip package structure includes a package body and a fingerprint identification chip. The package body includes a bottom surface and a lateral surface connected to the bottom surface, and defines a recessed portion at a junction of the bottom surface and the lateral surface. The fingerprint identification chip is received in the package body.
IPC 8 full level
CPC (source: EP US)
G06F 1/1637 (2013.01 - US); G06F 1/1684 (2013.01 - EP US); G06F 3/03547 (2013.01 - EP US); G06V 40/1329 (2022.01 - US); H01L 23/10 (2013.01 - US); H01L 24/06 (2013.01 - US); H04M 1/0202 (2013.01 - US); H04M 1/026 (2013.01 - EP US); H04M 1/18 (2013.01 - US); H05K 1/11 (2013.01 - US); G06F 2203/0338 (2013.01 - EP US)
Citation (search report)
- [XI] AU 2013100571 A4 20130523 - APPLE INC [US]
- [XI] WO 2014171751 A1 20141023 - IP CITY CO LTD [KR]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3285136 A1 20180221; US 10289892 B2 20190514; US 10565426 B2 20200218; US 2018053035 A1 20180222; US 2018260606 A1 20180913; WO 2018032882 A1 20180222
DOCDB simple family (application)
EP 17178047 A 20170627; CN 2017090338 W 20170627; US 201715627733 A 20170620; US 201815974789 A 20180509