EP 3287275 A1 20180228 - SILICONE RESIN TRANSPARENT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
Title (en)
SILICONE RESIN TRANSPARENT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
Title (de)
TRANSPARENTES SILIKONHARZSUBSTRAT UND VERFAHREN ZUR HERSTELLUNG DAVON
Title (fr)
SUBSTRAT TRANSPARENT DE RÉSINE DE SILICONE ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
JP 2016164158 A 20160824
Abstract (en)
The present invention provides a silicone resin transparent substrate, including one or more than one prepreg containing a silicone resin composition and a fibrous base, wherein the silicone resin transparent substrate has: an attached amount of the silicone resin composition to the fibrous base of 60% by mass or more and 99% by mass or less; a total light transmittance of 80% or more at 450 nm, as measured by a method disclosed in JIS K 7375:2008 in a thickness of 0.1 mm to 0.4 mm; and a water vapor permeability of 65 g/m 2 ¢day or less, as measured by Lyssy method in conformity with JIS K 7129:2008 in a thickness of 0.1 mm to 0.4 mm; together with a method for manufacturing the same. The silicone resin transparent substrate has excellent heat resistance and weatherability, together with flexibility, high transparency, and lower moisture permeability.
IPC 8 full level
B32B 17/04 (2006.01); C08J 5/08 (2006.01); C08J 5/24 (2006.01); C08L 83/04 (2006.01); H01L 23/14 (2006.01)
CPC (source: EP US)
B29C 70/42 (2013.01 - US); B32B 5/02 (2013.01 - EP US); B32B 17/04 (2013.01 - EP US); C08J 5/244 (2021.05 - EP US); C08J 5/249 (2021.05 - EP US); C08L 83/04 (2013.01 - EP US); B29K 2083/00 (2013.01 - US); B29K 2105/0872 (2013.01 - US); B29K 2995/0026 (2013.01 - US); B32B 2260/046 (2013.01 - EP US); B32B 2262/101 (2013.01 - EP US); C08G 77/12 (2013.01 - EP US); C08G 77/20 (2013.01 - EP US); C08J 2383/04 (2013.01 - EP US); C08J 2383/14 (2013.01 - US); H01L 23/145 (2013.01 - EP US)
Citation (applicant)
- JP 2004051960 A 20040219 - NITTO DENKO CORP
- JP 2015174937 A 20151005 - SHINETSU CHEMICAL CO
Citation (search report)
- [X] WO 2012064534 A1 20120518 - DOW CORNING [US], et al
- [X] WO 2008103227 A1 20080828 - DOW CORNING [US], et al
- [X] EP 2163585 A1 20100317 - SHINETSU CHEMICAL CO [JP]
- [X] US 2014120793 A1 20140501 - AKAHANE SAIKO [JP], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3287275 A1 20180228; EP 3287275 B1 20200304; JP 2018030953 A 20180301; US 2018057648 A1 20180301
DOCDB simple family (application)
EP 17001279 A 20170725; JP 2016164158 A 20160824; US 201715646481 A 20170711