Global Patent Index - EP 3291952 A1

EP 3291952 A1 20180314 - DEVICE FOR PUNCHING THIN MATERIALS

Title (en)

DEVICE FOR PUNCHING THIN MATERIALS

Title (de)

VORRICHTUNG ZUM STANZEN VON DÜNNWANDIGEN MATERIALIEN

Title (fr)

DISPOSITIF POUR LA DÉCOUPE DE MATERIAUX A ÉPAISSEUR RÉDUITE

Publication

EP 3291952 A1 20180314 (DE)

Application

EP 16716454 A 20160323

Priority

  • CH 6232015 A 20150506
  • CH 2016000050 W 20160323

Abstract (en)

[origin: WO2016176784A1] The invention relates to a device, by means of which thin-walled materials, such as labels and flat lids for containers, can be punched in micro or small quantities, comprising a band steel cutting edge (11) that is elastically mounted in the punching direction. The matrix is likewise elastically held on the matrix plate perpendicular to the punching direction by virtue of a matrix receptacle (33) fastened to the region in the matrix plate (27) that is adjacent to the recess (29). On the matrix receptacle, an elastically deformable intermediate plate (47) is placed, and the matrix (55) is placed on the intermediate plate.

IPC 8 full level

B26F 1/44 (2006.01)

CPC (source: EP KR US)

B26D 7/00 (2013.01 - KR); B26F 1/44 (2013.01 - EP KR US); B26D 2007/005 (2013.01 - KR); B26F 2001/4445 (2013.01 - EP KR US); B26F 2001/4463 (2013.01 - EP KR US); Y10T 83/2122 (2015.04 - US); Y10T 83/9307 (2015.04 - US); Y10T 83/9309 (2015.04 - US)

Citation (search report)

See references of WO 2016176784A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

WO 2016176784 A1 20161110; AU 2016257639 A1 20171130; AU 2016257639 B2 20200716; BR 112017023504 A2 20180731; BR 112017023504 B1 20210209; CA 2985124 A1 20161110; CA 2985124 C 20210518; CH 711043 A1 20161115; CN 107645981 A 20180130; CN 107645981 B 20200616; DK 3291952 T3 20190805; EP 3291952 A1 20180314; EP 3291952 B1 20190515; HR P20191325 T1 20191018; JP 2018516765 A 20180628; JP 6667553 B2 20200318; KR 102499558 B1 20230213; KR 20180062983 A 20180611; PL 3291952 T3 20191031; RS 58975 B1 20190830; TR 201907779 T4 20190621; UA 119199 C2 20190510; US 10828796 B2 20201110; US 2019152088 A1 20190523

DOCDB simple family (application)

CH 2016000050 W 20160323; AU 2016257639 A 20160323; BR 112017023504 A 20160323; CA 2985124 A 20160323; CH 6232015 A 20150506; CN 201680026337 A 20160323; DK 16716454 T 20160323; EP 16716454 A 20160323; HR P20191325 T 20190723; JP 2017557355 A 20160323; KR 20177035262 A 20160323; PL 16716454 T 20160323; RS P20190879 A 20160323; TR 201907779 T 20160323; UA A201710785 A 20160323; US 201615571385 A 20160323