Global Patent Index - EP 3300105 B1

EP 3300105 B1 20220713 - SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING THE SAME

Title (en)

SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING THE SAME

Title (de)

LEISTUNGSHALBLEITERMODUL UND VERFAHREN ZUR HERSTELLUNG EINES LEISTUNGSHALBLEITERMODULS

Title (fr)

MODULE SEMI-CONDUCTEUR DE PUISSANCE ET PROCÉDÉ DE FABRICATION D'UN MODULE SEMI-CONDUCTEUR DE PUISSANCE

Publication

EP 3300105 B1 20220713 (DE)

Application

EP 16190518 A 20160926

Priority

EP 16190518 A 20160926

Abstract (en)

[origin: CN107871672A] On one hand, the present invention relates to a method in which a first opening is generated. The first opening extends in a connection substance, and the connection substance enables a first semiconductor chip and a metal plate to be connected mutually in a material locking manner. The first opening is generated in such a way that a first load electrode of the first semiconductor chip is exposedout of the first opening. In addition, a first conductive connecting part is generated, is contacted with the first load electrode exposed out of the first opening and is electrically connected with the metal plate.

IPC 8 full level

H01L 23/488 (2006.01); B29C 45/14 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/18 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/538 (2006.01); H01L 23/544 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01)

CPC (source: CN EP)

H01L 21/4853 (2013.01 - CN); H01L 23/49811 (2013.01 - CN); H01L 23/5389 (2013.01 - EP); H01L 23/544 (2013.01 - EP); H01L 24/24 (2013.01 - EP); H01L 24/82 (2013.01 - EP); H01L 24/92 (2013.01 - EP); H01L 24/97 (2013.01 - EP); H01L 25/072 (2013.01 - EP); H01L 25/18 (2013.01 - EP); H01L 21/4828 (2013.01 - EP); H01L 23/3121 (2013.01 - EP); H01L 23/3735 (2013.01 - EP); H01L 24/29 (2013.01 - EP); H01L 24/32 (2013.01 - EP); H01L 24/83 (2013.01 - EP); H01L 2223/54426 (2013.01 - EP); H01L 2224/04026 (2013.01 - EP); H01L 2224/04105 (2013.01 - EP); H01L 2224/05624 (2013.01 - EP); H01L 2224/05647 (2013.01 - EP); H01L 2224/12105 (2013.01 - EP); H01L 2224/24137 (2013.01 - EP); H01L 2224/24245 (2013.01 - EP); H01L 2224/29101 (2013.01 - EP); H01L 2224/2919 (2013.01 - EP); H01L 2224/2929 (2013.01 - EP); H01L 2224/32225 (2013.01 - EP); H01L 2224/32245 (2013.01 - EP); H01L 2224/73267 (2013.01 - EP); H01L 2224/82005 (2013.01 - EP); H01L 2224/82007 (2013.01 - EP); H01L 2224/82105 (2013.01 - EP); H01L 2224/82106 (2013.01 - EP); H01L 2224/82138 (2013.01 - EP); H01L 2224/82801 (2013.01 - EP); H01L 2224/8284 (2013.01 - EP); H01L 2224/82986 (2013.01 - EP); H01L 2224/83424 (2013.01 - EP); H01L 2224/83439 (2013.01 - EP); H01L 2224/83444 (2013.01 - EP); H01L 2224/83447 (2013.01 - EP); H01L 2224/83455 (2013.01 - EP); H01L 2224/83469 (2013.01 - EP); H01L 2224/8384 (2013.01 - EP); H01L 2224/92244 (2013.01 - EP); H01L 2224/97 (2013.01 - EP); H01L 2924/10252 (2013.01 - EP); H01L 2924/10253 (2013.01 - EP); H01L 2924/10271 (2013.01 - EP); H01L 2924/10272 (2013.01 - EP); H01L 2924/10329 (2013.01 - EP); H01L 2924/1033 (2013.01 - EP); H01L 2924/10331 (2013.01 - EP); H01L 2924/10332 (2013.01 - EP); H01L 2924/10335 (2013.01 - EP); H01L 2924/10372 (2013.01 - EP); H01L 2924/10376 (2013.01 - EP); H01L 2924/1301 (2013.01 - EP); H01L 2924/1302 (2013.01 - EP); H01L 2924/13055 (2013.01 - EP); H01L 2924/13062 (2013.01 - EP); H01L 2924/13064 (2013.01 - EP); H01L 2924/13091 (2013.01 - EP); H01L 2924/15787 (2013.01 - EP); H01L 2924/15798 (2013.01 - EP); H01L 2924/181 (2013.01 - EP); H01L 2924/18301 (2013.01 - EP)

C-Set (source: EP)

  1. H01L 2924/181 + H01L 2924/00012
  2. H01L 2924/15787 + H01L 2924/05032
  3. H01L 2224/83447 + H01L 2924/00014
  4. H01L 2224/83424 + H01L 2924/00014
  5. H01L 2224/83439 + H01L 2924/00014
  6. H01L 2224/83444 + H01L 2924/00014
  7. H01L 2224/83455 + H01L 2924/00014
  8. H01L 2224/83469 + H01L 2924/00014
  9. H01L 2224/97 + H01L 2224/83
  10. H01L 2224/29101 + H01L 2924/014 + H01L 2924/00014
  11. H01L 2224/8384 + H01L 2924/00014
  12. H01L 2224/2929 + H01L 2924/0781
  13. H01L 2224/2919 + H01L 2924/07802
  14. H01L 2224/05647 + H01L 2924/00014
  15. H01L 2224/05624 + H01L 2924/00014
  16. H01L 2924/15787 + H01L 2924/05432
  17. H01L 2924/15787 + H01L 2924/05442

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 3300105 A1 20180328; EP 3300105 B1 20220713; CN 107871672 A 20180403; CN 107871672 B 20201030

DOCDB simple family (application)

EP 16190518 A 20160926; CN 201710879479 A 20170926